Datasheet

TPS2543
SLVSBA6 –FEBRUARY 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
T
A
PACKAGE DEVICE TOP-SIDE MARKING
–40°C to 125°C QFN16 TPS2543 2543
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range, voltages are referenced to GND (unless otherwise noted)
LIMIT UNIT
Voltage range IN, EN, ILIM_LO, ILIM_HI, FAULT, STATUS, ILIM_SEL, –0.3 to 7 V
CTL1, CTL2, CTL3, OUT
IN to OUT –7 to 7
DP_IN, DM_IN, DP_OUT, DM_OUT –0.3 to (IN + 0.3) or 5.7
Input clamp current DP_IN, DM_IN, DP_OUT, DM_OUT ±20 mA
Continuous current in SDP or CDP DP_IN to DP_OUT or DM_IN to DM_OUT ±100 mA
mode
Continuous current in BC1.2 DCP DP_IN to DM_IN ±50 mA
mode
Continuous output current OUT Internally limited
Continuous output sink current FAULT, STATUS 25 mA
Continuous output source current ILIM_LO, ILIM_HI Internally limited mA
ESD rating HBM 2 kV
HBM wrt GND and each other, DP_IN, DM_IN 8
CDM 500 V
Operating junction temperature, T
J
–40 to Internally limited °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS2543
THERMAL METRIC
(1)
UNITS
RTE (16 PIN)
θ
JA
Junction-to-ambient thermal resistance 53.4
θ
JCtop
Junction-to-case (top) thermal resistance 51.4
θ
JB
Junction-to-board thermal resistance 17.2
°C/W
ψ
JT
Junction-to-top characterization parameter 3.7
ψ
JB
Junction-to-board characterization parameter 20.7
θ
JCbot
Junction-to-case (bottom) thermal resistance 3.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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