Datasheet

140
1k
100k
100M
FREQUENCY (Hz)
-20
40
GAIN (dB)
10M
1M
10k
100
80
20
0
60
120
158
-23
45
113
90
23
0
68
135
PHASE
(
°
)
GAIN
PHASE
R
L
= 1 M:
C
L
= 20 pF
±1.35V
±5V
±15V
±1.35V
±15V
±5V
140
1k
100k
100M
FREQUENCY (Hz)
-20
40
GAIN (dB)
10M
1M
10k
100
80
20
0
60
120
158
-23
45
113
90
23
0
68
135
PHASE
(
°
)
GAIN
PHASE
V
S
= ±15V
R
L
= 1 M:
C
L
= 20 pF
-40°C
25°C
125°C
125°C, 25°C, -40°C
LM7341
SNOSAW9B –MAY 2008–REVISED MARCH 2013 www.ti.com
Typical Performance Characteristics
Figure 1. Open Loop Frequency Response Figure 2. Open Loop Frequency Response
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge-Device Model 1000V
V
IN
Differential ±15V
Voltage at Input/Output Pin (V
+
) + 0.3V, (V
−
) −0.3V
Supply Voltage (V
S
= V
+
− V
−
) 35V
Input Current ±10 mA
Output Current
(4)
±20 mA
Power Supply Current 25 mA
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec.) 260°C
Storage Temperature Range −65°C to 150°C
Junction Temperature
(5)
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly unto a PC board.
Operating Ratings
(1)
Supply Voltage (V
S
= V
+
− V
−
) 2.5V to 32V
Temperature Range
(2)
−40°C to 125°C
Package Thermal Resistance (θ
JA
) 5-Pin SOT-23 325°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly unto a PC board.
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