Datasheet
LM2735
www.ti.com
SNVS485F –JUNE 2007–REVISED APRIL 2013
Electrical Characteristics
Limits in standard type are for T
J
= 25°C only; limits in boldface type apply over the junction temperature range of (T
J
= -
40°C to 125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values
represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. V
IN
= 5V unless
otherwise indicated under the Conditions column.
Symbol Parameter Conditions Min Typ Max Units
−40°C ≤ to T
J
≤ +125°C (SOT-23) 1.230 1.255 1.280
0°C ≤ to T
J
≤ +125°C (SOT-23) 1.236 1.255 1.274
−40°C ≤ to T
J
≤ +125°C (WSON) 1.225 1.255 1.285
V
FB
Feedback Voltage V
−0°C ≤ to T
J
≤ +125°C (WSON) 1.229 1.255 1.281
−40°C ≤ to T
J
≤ +125°C 1.220 1.255 1.290
(MSOP-PowerPAD)
0°C ≤ to T
J
≤ +125°C (MSOP-PowerPAD) 1.230 1.255 1.280
ΔV
FB
/V
IN
Feedback Voltage Line Regulation V
IN
= 2.7V to 5.5V 0.06 %/V
I
FB
Feedback Input Bias Current 0.1 1 µA
LM2735-X 1200 1600 2000 kHz
F
SW
Switching Frequency
LM2735-Y 360 520 680
LM2735-X 88 96
D
MAX
Maximum Duty Cycle %
LM2735-Y 91 99
LM2735-X 5
D
MIN
Minimum Duty Cycle %
LM2735-Y 2
SOT-23 and MSOP-PowerPAD 170 330
R
DS(ON)
Switch On Resistance mΩ
WSON 190 350
I
CL
Switch Current Limit 2.1 3 A
SS Soft Start 4 ms
LM2735-X 7.0 11 mA
Quiescent Current (switching)
I
Q
LM2735-Y 3.4 7
Quiescent Current (shutdown) All Options V
EN
= 0V 80 nA
Undervoltage Lockout VIN Rising 2.3 2.65 V
UVLO
VIN Falling 1.7 1.9
Shutdown Threshold Voltage See
(1)
0.4
V
EN_TH
V
Enable Threshold Voltage See
(1)
1.8
I
-SW
Switch Leakage V
SW
= 24V 1.0 µA
I
-EN
Enable Pin Current Sink/Source 100 nA
WSON and MSOP-PowerPAD Package 80
Junction to Ambient
θ
JA
°C/W
0 LFPM Air Flow
(2)
SOT-23 Package 118
WSON and MSOP-PowerPAD Package 18
θ
JC
Junction to Case
(2)
°C/W
SOT-23 Package 60
T
SD
Thermal Shutdown Temperature
(3)
160 °C
Thermal Shutdown Hysteresis 10
(1) Do not allow this pin to float or be greater than V
IN
+0.3V.
(2) Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.
(3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device
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