Datasheet

LM25010
SNVS419D –DECEMBER 2005–REVISED FEBRUARY 2013 www.ti.com
possible. The exposed pad is internally connected to the IC substrate. The use of wide PC board traces at the
pins, where possible, can help conduct heat away from the IC. The four NC pins on the HTSSOP package are
not electrically connected to any part of the IC, and may be connected to ground plane to help dissipate heat
from the package. Judicious positioning of the PC board within the end product, along with the use of any
available air flow (forced or natural convection) can help reduce the junction temperature.
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