GE Sensing & Inspection Technologies A GUIDE TO THE INSPECTION AND ANALYSIS OF ELECTRONIC PACKAGES with phoenix|x-ray microfocus and nanofocus X-ray systems
FAQs about X-ray How X-ray inspection source large FOD works object FDD detector high magnification low magnification insulator UH cathode (filament) UG UACC grid anode magnetic lens electron beam deflection unit X-ray starts with a sample being irradiated by an X-ray source and projected onto a detector. The geometric magnification M of the image is the ratio of focus-detector distance (FDD), Focus-object distance (FOD): M=FDD/FOD. The smaller the focal spot, the greater the resolution.
The View Inside What can X-ray inspection tell us about package quality? Electronic packages are sophisticated electronic devices with complex, internal features. In order to meet the quality requirements of the industry, X-ray inspection solutions must be capable of delivering detail detectabilities in the submicron range and detecting hidden defect flaws.
Image definition and contrast What is it that makes the difference? Image definition and contrast are both key to detecting. With the nanofocus technology with detail detectabilities down to 200 nanometers, submicron resolutions and a fully digital high-contrast|detector that outperforms any image intensifierbased image chain, phoenix|x-ray is once more leading the way in X-ray inspection technology.
Automated Inspection The efficient way of process control and rework: AXI Efficient soldering process control requires the acquisition of statistical data on the solder joints of a larger number of samples. phoenix|x-ray offers a range of plug-in software modules for the automatic evaluation of standard solder joints like BGA, QFP, QFN, or PTH. For non-typical interconnections, appropriate modules can quickly be customized with the XE² (X-ray image Evaluation Environment) software.
The Third Dimension Oblique or straight X-ray inspection seen from a different perspective Sometimes when inspecting a sample, it may become necessary to see your sample from a different angle. An example of this would be an inspection via platings or wire loops. phoenix|x-ray systems provide oblique views of up to 70 degrees using the unique ovhm-technology. Automatic isocentric manipulator movement locks the field of view during rotation and ovhm tilt in the image centre.
Systems phoenix|x-ray offers a wide range of X-ray systems in different configurations for a variety of inspection tasks in the electronics and semiconductor industries.
Regional Contact Information Europe, Asia, Africa, South America GE Sensing & Inspection Technologies Niels-Bohr-Str. 7 31515 Wunstorf P.O. Box 6241 31510 Wunstorf Germany Tel.: +49 5031 172 0 Fax: +49 5031 172 299 E-mail: phoenix-info@ge.com phoenix-asia@ge.com Americas GE Sensing & Inspection Technologies 50 Industrial Park Road Lewistown, PA 17044 USA Tel: +1 (866) 243 2638 (toll-free) Tel: +1 (717) 242 0327 E-mail: phoenix-usa@ge.com www.phoenix-xray.
