Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV824MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV824Q1MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV824Q1MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Dec-2013
Pack Materials-Page 3
