Datasheet
Table Of Contents
- Features
- Applications
- Description
- Absolute Maximum Ratings
- Operating Ratings
- Electrical Characteristics
- I2C Interface
- Timing Characteristics
- Timing Diagram
- Typical Performance Characteristics
- Function Description
- Application Information
- Revision History

LMP91000
www.ti.com
SNAS506H –JANUARY 2011–REVISED MARCH 2013
PIN DESCRIPTIONS (continued)
Name Pin Description
CE 14 Counter Electrode. Output to drive Counter Electrode of the chemical sensor
DAP Connect to AGND
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2kV
Charge-Device Model 1kV
Machine Model 200V
Voltage between any two pins 6.0V
Current through VDD or VSS 50mA
Current sunk and sourced by CE pin 10mA
Current out of other pins
(4)
5mA
Storage Temperature Range -65°C to 150°C
Junction Temperature
(5)
150°C
For soldering specifications:
see product folder at www.national.com and
www.national.com/ms/MS/MS-SOLDERING.pdf
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the
device is functional and the device should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field- Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) All non-power pins of this device are protected against ESD by snapback devices. Voltage at such pins will rise beyond absmax if
current is forced into pin.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and the ambient temperature, T
A
. The maximum allowable power
dissipation at any ambient temperature is P
DMAX
= (T
J(MAX)
- T
A
)/ θ
JA
All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage V
S
=(VDD - AGND) 2.7V to 5.25V
Temperature Range
(2)
-40°C to 85°C
Package Thermal Resistance
(2)
14-Pin WSON (θ
JA
) 44 °C/W
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Operating Ratings is not implied. Operating Ratings indicate conditions at which the
device is functional and the device should not be operated beyond such conditions.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and the ambient temperature, T
A
. The maximum allowable power
dissipation at any ambient temperature is P
DMAX
= (T
J(MAX)
- T
A
)/ θ
JA
All numbers apply for packages soldered directly onto a PC board.
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Product Folder Links: LMP91000