Datasheet
zation noise only. With an input range equal to the full-
scale range of the ADC, calculate the ENOB as follows:
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:
where V
1
is the fundamental amplitude, and V
2
through
V
5
are the amplitudes of the 2nd- through 5th-order
harmonics.
Spurious-Free Dynamic Range
Spurious-free dynamic range (SFDR) is the ratio of the
RMS amplitude of the fundamental (maximum signal
component) to the RMS value of the next largest distor-
tion component.
Full-Power Bandwidth
Full-power bandwidth is the frequency at which the input
signal amplitude attenuates by 3dB for a full-scale input.
Full-Linear Bandwidth
Full-linear bandwidth is the frequency at which the sig-
nal-to-noise plus distortion (SINAD) is equal to 56dB.
Intermodulation Distortion
Any device with nonlinearities creates distortion prod-
ucts when two sine waves at two different frequencies
(f1 and f2) are input into the device. Intermodulation
distortion (IMD) is the total power of the IM2 to IM5
intermodulation products to the Nyquist frequency rela-
tive to the total input power of the two input tones, f1
and f2. The individual input tone levels are at
-6dBFS.
THD
VVVV
V
=×
+++
⎛
⎝
⎜
⎜
⎞
⎠
⎟
⎟
20
2
2
3
2
4
2
5
2
1
log
ENOB
SINAD
=
−
⎛
⎝
⎜
⎞
⎠
⎟
176
602
.
.
MAX1377/MAX1379/MAX1383
Dual, 12-Bit, 1.25Msps Simultaneous-Sampling
ADCs with Serial Interface
24 ______________________________________________________________________________________
PART SUPPLY VOLTAGE (V)
INTERNAL
REFERENCE
VOLTAGE (V)
INPUT VOLTAGE
RANGE
SAMPLING RATE
(Msps)
MAX1377 2.7 to 3.6 2.048 0 to V
REF,
±V
REF
/2 1.25
MAX1379 4.75 to 5.25 4.096 0 to V
REF,
±V
REF
/2 1.25
MAX1383 4.75 to 5.25 2.5 ±10V 1.25
Selector Guide
19
20
18
17
7
6
8
REF
AGND
AVDD
9
REFSEL
CNVST
DOUT1
DOUT2
CS
12
AGND
45
15 14 12 11
AIN1B
AIN1A
DGND
U/B
AIN2B
AIN2A
MAX1377
MAX1379
MAX1383
RGND
SCLK
3
13
SEL
16
10
V
L
S/D
TQFN
+
TOP VIEW
(EXPOSED PAD)*
*CONNECT PAD TO AGND
Pin Configuration
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
20 TQFN-EP T2055-4
21-0140
Chip Information
PROCESS: BiCMOS