Datasheet

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 11/8/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
D
1
Minimum
Note 1
E
1
P
0
P
2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P
1
T
2
Maximum
W
Maximum
A
0
,B
0
&K
0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single (4 mm)
and double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S
1
< 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B
1
dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A
0
, B
0
and K
0
shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A
0
and B
0
are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.