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ManualsBrandsDow Corning ManualsThermal Compounds & AdhesivesHeat Conducting Paste 0.55 W/mK 100 g

P R O D U C T I N F O R M A T I O N

Information About Dow Corning

Brand

Thermally Conductive Materials

Long-term, reliable protection of sensitive circuits and

components is important in many of today’s delicate and

demanding electronic applications. With the increase in

processing power and the trend toward smaller, more com-

pact electronic modules, the need for thermal management

is growing. Dow Corning’s family of thermally conductive

materials provides excellent thermal management options.

Thermally conductive silicones function as heat transfer

media, durable dielectric insulation, barriers against envi-

ronmental contaminants and as stress-relieving shock and

vibration absorbers over a wide temperature and humidity

range.

In addition to sustaining their physical and electrical proper-

ties over a broad range of operating conditions, silicones

are resistant to ozone and ultraviolet degradation and have

good chemical stability. Dow Corning’s line of thermal

management materials includes adhesives, encapsulants,

compounds and gels.

Good heat transfer is dependent on a good interface between

the heat producing device and the heat transfer media.

Silicones have a low surface tension that enables them to

wet most surfaces, which can lower the thermal contact

resistance between the substrate and the material.

Thermally Conductive Adhesives

Type

Noncorrosive, one-part, moisture-cure RTV and one- or two-

part heat-cure silicone elastomers

Physical Form

Nonﬂowing and ﬂowable options; cure to ﬂexible elastomers

Special Properties

Room-temperature or fast thermal cure; variety of thermal con-

ductivities; resist humidity and other harsh environments; good

dielectric properties; self-priming adhesion; low stress

Potential Uses

Heat sink or base plate attach; potting power supplies

Thermally Conductive Encapsulants

Type

Two-part silicone elastomers

Physical Form

Flowable liquid; cures to ﬂexible elastomer

Special Properties

Constant cure rate, regardless of sectional thickness or degree

of conﬁnement; no post-cure required

Potential Uses

Potting of high-voltage transformers and sensors; assembly of

substrates to heat sinks; gap ﬁll material between heat sources

and heat sinks

Thermally Conductive Compounds

Type

Non-curing; thermally conductive silicone pastes

Special Properties

High thermal conductivity; low bleed; high-temperature

stability

Potential Uses

Gap ﬁll materials between heat sources and heat sinks

Thermally Conductive Gels

Type

Two-part heat-cure gels

Physical Form

1:1 mix ratio; low viscosity

Special Properties

Heat accelerable; wide operating temperatures; cure to low-

modulus materials

Potential Uses

Gap ﬁll material; potting of electronic modules; base materials

for thermally conductive gel sheet

Materials for Pad Manufacturing

Type

Two-part heat-cure materials

Special Properties

Soft, good thermal conductivity, low viscosity

Potential Uses

Base material for thermally conductive pads

Summary of content (16 pages)

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P R O D U C T I N F O R M A T I O N Information About Dow Corning® Brand Thermally Conductive Materials Thermally Conductive Materials Long-term, reliable protection of sensitive circuits and components is important in many of today’s delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing.
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PRODUCT INFORMATION – THERMALLY CONDUCTIVE ADHESIVES Dow Corning® Brand Product Description Features Thermally Conductive Adhesives SE4420 Thermally Conductive Adhesive One-part moisture cure Flowable with moderate thermal conductivity; fast tack-free SE4422 Thermally Conductive Adhesive One-part moisture cure High viscosity with moderate thermal conductivity; UL 94 V-1 rating; fast tack-free SE4486 CV Thermally Conductive Adhesive Flowable; one-part moisture cure Flowable with good thermal condu
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Dow Corning® Brand Product Potential Uses Application Methods Thermally Conductive Adhesives SE4420 Thermally Conductive Adhesive Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Automated or manual dispensing SE4422 Thermally Conductive Adhesive Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks; sealing gas hot water heater burners Automated or manual dispensing SE4486 CV Thermally Conductive Adhesive Adhesive for powe
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PRODUCT INFORMATION – THERMALLY CONDUCTIVE MATERIALS Dow Corning® Brand Product Description Features Thermally Conductive Encapsulants SE4410 Thermally Conductive Encapsulant Two-part; low viscosity Heat cure; moderate thermal conductivity; UL 94 V-0 rating SE4447 CV Thermally Conductive Encapsulant Two-part; gray Excellent thermal conductivity; low volatility; excellent high temperature stability and low temperature resistance SE4448 CV Thermally Conductive Encapsulant Two-part, thermally conduct
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Dow Corning® Brand Product Potential Uses Application Methods Thermally Conductive Encapsulants SE4410 Thermally Conductive Encapsulant Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks Automated or manual dispensing SE4447 CV Thermally Conductive Encapsulant Cured-in-place gap filling between heat-generating electronic components and the case or heat sink Automated meter-mix SE4448 CV Thermally Conductive Encapsulant Excellent cured-in-place gap filling betw
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TYPICAL PROPERTIES – THERMALLY CONDUCTIVE ADHESIVES Specification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.
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MPa kgf/cm2 Elongation,% Compression Modulus at 10%, psi Linear CTE, micron/mC volts/mil kV/mm Dielectric Constant at 100 Hz Dielectric Constant at 100 kHz Dielectric Constant at 1 MHz Dissipation Factor at 100 Hz Dissipation Factor at 100 kHz Dissipation Factor at 1 MHz Volume Resistivity, ohm-cm Shelf Life from Date of Manufacture, months Dielectric Strength psi Thermal Conductivity at 25°C (77°F), Watt/meter-K Tensile Strength SE4420 Thermally Conductive Adhesive 0.9 725 5 50.
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TYPICAL PROPERTIES – THERMALLY CONDUCTIVE MATERIALS Specification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.
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Compression Modulus at 10%, psi Linear CTE, micron/mC volts/mil kV/mm Dielectric Constant at 100 Hz Dielectric Constant at 100 kHz Dielectric Constant at 1 MHz Dissipation Factor at 100 Hz Dissipation Factor at 100 kHz Dissipation Factor at 1 MHz Volume Resistivity, ohm-cm Shelf Life from Date of Manufacture, months 972 6.7 68.3 60 – – 660 26 – – 4.4 – – 0.002 1.00E+15 12 SE4447 CV Thermally Conductive Encapsulant 20 0.14 1.4 20 7 72 270 10.6 6.6 6.5 – 0.002 <0.
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THERMALLY CONDUCTIVE ADHESIVES Dow Corning offers a variety of noncorrosive, thermally conductive silicone adhesives that are ideally suited for use in bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are major concerns.
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THERMALLY CONDUCTIVE MATERIALS FOR PAD MANUFACTURING Dow Corning thermally conductive materials for pad manufacturing are soft, two-part, thermally conductive elastomers. These low-viscosity materials feature good thermal conductivity, making them suitable as base material for thermally conductive pads. Automated airless dispense equipment can be used to reduce or avoid the need to de-air.
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PRIMER SELECTION GUIDE Specification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.
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SOLVENT EXPOSURE Although highly filled silicones such as those discussed in this data sheet are generally more resistant to solvent or fuel exposure, standard silicones are intended only to survive splash or intermittent exposures. Testing should be done to confirm performance of the adhesives in the application and under the specified environmental conditions. SAFE HANDLING INFORMATION PRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCU MENT.
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