Dell EMC PowerStore Hardware Information Guide for PowerStore 1000, 3000, 5000, 7000, and 9000 Version 2.x June 2021 Rev.
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Contents Additional Resources.....................................................................................................................4 Chapter 1: Platform overview........................................................................................................ 5 Description............................................................................................................................................................................
Preface As part of an improvement effort, revisions of the software and hardware are periodically released. Some functions that are described in this document are not supported by all versions of the software or hardware currently in use. The product release notes provide the most up-to-date information about product features. Contact your service provider if a product does not function properly or does not function as described in this document.
1 Platform overview Topics: • Description Description The PowerStore platform has a flexible design capable of meeting the requirements of multiple different storage applications with support for high availability. The design includes two major configurations: ● PowerStore T model appliances ● PowerStore X model appliances PowerStore T model appliances serve Block and File services, and the software stack is deployed directly on the system.
2 Base enclosure component descriptions Topics: • • • • Base enclosure component overview Base enclosure front view Base enclosure rear view Node internal components Base enclosure component overview The 2U, 25-drive base enclosure consists of the following components: ● ● ● ● ● Slots for 25 2.5-inch drives Midplane Node Power supply module EMI shielding Drives Each drive resides in a drive carrier.
Node Each base enclosure contains two nodes. The node is the intelligent component providing the compute capability of the base enclosure. Node power supply module Each node contains a power supply module that connects the system to an exterior power source. If one power supply fails, redundant power supplies can keep the entire base enclosure running. The power supplies include LEDs to indicate component status. A latch on the module locks it into place to ensure proper connection.
Figure 2. Base enclosure and drive LEDs Table 2. Base enclosure and drive LEDs LED Location Drive fault Drive activity Base enclosure power and fault State Description Amber Fault has occurred. Off No fault has occurred. Blue Drive activity. Off Drive is powered off. Blue Power is on. No fault has occurred. Amber Power is on. Fault has occurred within the enclosure. Blue and amber alternating System not initialized. Off Power is off.
Figure 4. WWN Seed Tag location Base enclosure rear view The rear of the base enclosure contains two nodes: node A and node B. Each node contains the following hardware components: ● One embedded module ● Two optional I/O modules ● One power supply module Figure 5. Base enclosure rear view with hardware component locations Table 3.
The first two ports of the 4-port card on the embedded module connect to a Top-of-Rack (ToR) switch. NOTE: Both nodes must have the same type of embedded modules in the same slots.
The 4-port 10GBaseT embedded module serves Ethernet traffic and iSCSI block protocol. Speeds of 1GbE and 10 GbE are supported. Embedded module and 4-port card LED status Figure 7. Embedded module LEDs Table 5. Embedded module LEDs LED Embedded module power Ethernet port link Ethernet port activity SAS port/activity Link Port link Node fault Node power Unsafe to remove Location State Description Amber Embedded module has faulted. Off No fault has occurred, normal operation.
Table 5. Embedded module LEDs (continued) LED Location State Description Off Safe to remove the node or embedded module when the node or embedded module has been properly prepared. Base enclosure I/O module types 4-port 25GbE SFP based I/O module The 4-port 25GbE SFP based I/O module is an Ethernet I/O module that is used to serve Ethernet network traffic and iSCSI block protocol to hosts for the platform. The I/O module uses an optical 1G, 10G, or 25G capable SFP+ connection to a host or switch port.
Port labels in PowerStore Manager In ● ● ● PowerStore Manager, on the Hardware > Rear View tab for an appliance, the following port abbreviations are used: FEPort - Physical Frontend Port hFEPort - Hypervisor Frontend Port vFEPort - Virtual Frontend Port Base enclosure power supply Figure 9. Base enclosure power supply LEDs Table 7. Base enclosure power supply LEDs LED Location State Description Solid amber Power supply or backup fault. Check cable connection. Off No fault.
Fan module Seven redundant fan modules connect to the motherboard within the node. These fans provide continuous airflow through the front drives and through the rear of the node to keep the components at optimal operating temperatures. NOTE: If two cooling modules fault within the same node, the node performs a protective thermal shutdown.
3 Expansion enclosure component descriptions Topics: • 2U, 25-drive expansion enclosure 2U, 25-drive expansion enclosure The 2U, 25-drive expansion enclosure includes slots for 25 2.5-inch drives. It uses a 12-Gb/s SAS interface for communication between the nodes and the expansion enclosure. 2U, 25-drive expansion enclosure front view The front of the 2U, 25-drive expansion enclosure includes the following components: ● Drives in 2.5-inch carriers (hot-swappable) ● Status LEDs Figure 10.
Table 9.
2 1 8 x4 # x4 7 6 5 4 3 Figure 12. 2U, 25-drive expansion enclosure LCC ports, LEDs, and connectors Table 10. 2U, 25 (2.5-inch) expansion enclosure LCC component locations Location Description 1 Ejector latch handles 2 LCC fault LED 3 LCC management port (RJ-12) (not used) 4 Back-end bus ID display (always displays 01) 5 LCC power LED 6 Enclosure ID display 7 12-Gb/s SAS ports 8 SAS port status LED Table 11.
LCCs have individual soft-start switches that protect the drives and LCCs when they are installed while the expansion enclosure is powered on. The enclosure cooling system includes two dual-blower modules. Power supply and cooling module connectors and LEDs The following figure shows an example of a 2U, 25-drive expansion enclosure AC power supply and cooling module with a recessed power in plug and status LEDs. 1 2 3 4 6 5 Figure 13.
4 Technical specifications Topics: • • • • • • Physical specifications for PowerStore X model and PowerStore T model Dimensions and weight for PowerStore X model and PowerStore T model Power requirements for PowerStore X model and PowerStore T model Power requirements for the 2U 25-drive expansion enclosure Operating limits Shipping and storage requirements Physical specifications for PowerStore X model and PowerStore T model Table 14.
2U, 25-drive expansion enclosure Table 16. 2U, 25-drive expansion enclosure dimensions and weight Dimension Value Weight (fully populated) 34.98 kg (77.11 lb) Vertical size 2 NEMA units Height 8.64 cm (3.4 in) Width 44.45 cm (17.5 in) Depth 34.29 cm (13.5 in) NOTE: The weight does not include mounting rails. Allow 3.6 kg (8 lbs) for a rail set.
Power requirements for PowerStore X model and PowerStore T model Power requirements will vary depending on system configuration, loading, and environmental conditions. The table below describes the maximum expected power draw. To estimate power consumption values for your specific environment, go to https://powercalculator.emc.com/. Table 17. Power requirements Requirement 1000T/ 1000X Maximum input power 3000T/3000X 5000T 5000X For 100-120V, a customer-supplied step-up transformer is required 8.
Power requirements for the 2U 25-drive expansion enclosure Power requirements vary depending on system configuration, loading, and environmental conditions. The table below describes the maximum expected power draw. To estimate power consumption values for your specific environment, go to https:// powercalculator.emc.com/. Table 19. Power requirements Requirement Description AC line voltage 100 to 240 VAC ± 10%, single-phase, 47 to 63 Hz AC line current (operating maximum) 3.32 A max at 100 VAC 1.
Table 21. Shipping and storage requirements Requirement Description Ambient temperature -40° F to 149°F (-40°C to 65°C) Temperature gradient 45°F/hr (25°C/hr) Relative humidity 10% to 90% noncondensing Elevation -50 to 35,000 ft (-16 to 10,600 m) Storage time (unpowered) Recommendation Do not exceed 6 consecutive months of unpowered storage.
Storage time (unpowered) recommendation: do not exceed 6 consecutive months of unpowered storage. Fire suppressant disclaimer Fire prevention equipment in the computer room should always be installed as an added safety measure. A fire suppression system is the responsibility of the customer. When selecting appropriate fire suppression equipment and agents for the data center, choose carefully.