User's Manual

WIESON
INTERNATIONAL
CO., LTD.
WM2012CU
User Manual
TYPE OF PRODUCT
WLAN/BT MODULE
CONFIDENTIAL
No part of the information shown of this document may be used in any way without office stamp or written consent of
WIESON INTERNATIONAL CO., LTD.
11
Reference Temperature Reflow Chart
Note:
1. If the system PCBA is double side design please reflow the side without this module first.
2. Don’t let the solder machine temperature over 250℃ or follow solder paste vender’s
recommended temperature.
3. The Ramp-up temperature speed is 1~4
o
C per second, the Ramp-down temperature speed is
1~4
o
C per second.
4. This temperature reflow chart is for reference only, it depends on the manufaturing machine’s
characters requirement.