Datasheet

7. Performance specification :
*Solderability 95 % coverage Min.
Test temperature of solder : 245
℃
Dipping them solder : 2-3 seconds
(Sub-clause 4.17)
Wave soldering condition:
(2 cycles Max.)
Soldering temp.
reference
Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec.
Suggestion solder temp.: 235 ~ 255 ℃, 10 sec. (Max.)
Peak temp.: 260 ℃
Electrical characteristics shall be
satisfied. Without distinct
deformation in appearance.
(95 % coverage Min.)
Reflow soldering condition: (2 cycles Max.)
Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec.
Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec.
Peak temp.: 260 ℃
Hand soldering condition:
The soldering iron tip temperature should be less than
300℃and maximum contract time should be 5 sec.
Thick Film Chip Resistors (Terminal Lead Free)
LimitsCharacteristics
Test Methods
( JIS C 5201-1 )
Distributed by Conrad Electronic SE • Klaus-Conrad-Str. 1 • D-92240 Hirschau
Datasheet
V1_0717_01_en
7