Datasheet

7. Performance specification :
Soldering Resistance change rate is: Dip the resistor into a solder bath having
Heat ±(1%+0.05) Max. a temperature of 260°C±3°C and hold it for 10±1
seconds.
(Sub-clause 4.18)
Resistance change after continuous
5 cycles for duty cycle specified below :
Resistance change rate is
Step Temperature Time
Temperature
± 5% (1.0% + 0.05Ө) Max.
1
-55к ± 3к
30 mins
cycling
± 1% (0.5% + 0.05Ө) Max.
2 Room temp.
10Д15 mins
3
+155к ± 2к
30 mins
4 Room temp.
10Д15 mins
(Sub-clause 4.19)
Resistance change after 1,000 hours
Load life in Resistance change rate is (1.5 hours "on", 0.5 hour "off" ) at RCWV
humidity
± 5% (3.0% + 0.1Ө) Max.
in a humidity chamber controlled at
± 1% (1.0% + 0.1Ө) Max. 40к ± 2к and 90 to 95 % relative humidity
(Sub-clause 4.24.2.1)
Resistance change rate is Permanent resistance change after 1,000 hours
Load Life
± 5% (3.0% + 0.1Ө) Max.
operating at RCWV, with duty cycle of
± 1% (1.0% + 0.1Ө) Max. (1.5 hours"on", 0.5 hour"off") at 70кʳ± 2кʳ˴̀˵˼˸́̇
(Sub-clause 4.25.1)
Terminal Resistance change rate is Twist of Test Board :
bending
± (1.0% + 0.05Ө) Max.
Y/X = 5/90 mm for 10 seconds
(Sub-clause 4.33)
The resistors of 0 only can do the characteristic noted of *
LimitsCharacteristics
Thick Film Chip Resistors (Terminal Lead Free)
Test Methods
( JIS C 5201-1 )
Distributed by Conrad Electronic SE • Klaus-Conrad-Str. 1 • D-92240 Hirschau
Datasheet
V1_0717_01_en
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