Datasheet

7. Performance specification :
Wave Solder:
Test temperature of solder:
245°C ±3°C dipping time in solder : 2-3 seconds.
Refolw:
Solderability 95 % coverage Min.
Soldering heat Resistance change rate is:
± (1.0%+0.05) Max.
4.18 Dip the resistor into a solder bath having
a temperature of 260°C±3°C and hold it for 10±1
seconds.
4.19 Resistance change after continuous
5 cycles for duty cycle specified below :
Step Temperature Time
Temperature 1
-55к ± 3к
30 mins
cycling 2 Room temp.
10Д15 mins
Resistance change rate is
± 5% (1.0% + 0.05Ө) Max.
± 1% (0.5% + 0.05Ө) Max.
3
+155к ± 2к
30 mins
4 Room temp.
10Д15 mins
High Power Thick Film Chip Resistors
Characteristics Limits
Test Methods
( JIS C 5201-1 )
Distributed by Conrad Electronic SE • Klaus-Conrad-Str. 1 • D-92240 Hirschau
Datasheet
V1_0717_01_en
7