Toshiba Personal Computer QOSMIO F30 series Maintenance Manual TOSHIBA CORPORATION File Number 960-555 [CONFIDENTIAL]
Copyright © 2006 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba QOSMIO F30 series Maintenance Manual First edition March 2006 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer QOSMIO F30 series. NOTE: Each model of QOSMIO F30 series has a different configuration. For each model’s configuration, refer to the parts list dedicated to it. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the QOSMIO F30 series system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-6 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive.........................................................
2.17 Bridge media Slot Troubleshooting ......................................................................... 2-62 2.18 Fingerprint sensor .................................................................................................... 2-63 Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test .............................................................
3.29 Sound/LAN/Modem Test Program.......................................................................... 3-76 3.30 IEEE1394 Test program .......................................................................................... 3-80 3.31 Bluetooth Test program ........................................................................................... 3-81 3.32 SETUP ..................................................................................................................... 3-91 3.
4.26 Analog TV tuner ...................................................................................................... 4-60 4.27 CPU fan/CPU heat sink/CPU................................................................................... 4-61 4.28 GPU heat sink .......................................................................................................... 4-65 4.29 North bridge heat sink..............................................................................................
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Chapter 1 Hardware Overview [CONFIDENTIAL]
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1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-6 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive...............................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-5 Figure 1-2 System block diagram.................................................................................... 1-6 Figure 1-3 2.5-inch HDD............................................................................................... 1-10 Figure 1-4 DVD Super Muti drive (Double-Layer) ...................................................... 1-12 Figure 1-5 Keyboard....
1.1 Features 1 1 Hardware Overview Features 1.1 Features The QOSMIO F30 series are high performance all-in-one PCs running an Intel® CoreTM Duo/Solo or Intel® Celeron® M processor. There some models and options. Refer to the Parts List for the configuration of each model and options. The features are listed below. Microprocessor Microprocessor that is used will be different of the model. Intel® CoreTM Duo CoreTM Duo-2M 1.66GHz (Processor Number : T2300) 1.83GHz (Processor Number : T2400) 2.
1 Hardware Overview 1.1 Features 2nd HDD 40GB, 60GB, 80GB, 100GB or 120GB serial-ATA drive. 2.5 inch x 9.5mm height. Optical devices A slot-loading style DVD Super Multi drive (supporting double layer) is equipped. Keyboard An-easy-to-use 85(US)/86(UK)-key keyboard provides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft® Windows® XP.
1.1 Features 1 Hardware Overview Wireless LAN (PCI Express Mini card) The wireless LAN is equipped in the PCI Express Mini card slot. LAN/MODEM Connectors for 10M/100M Ethernet or Gigabit Ethernet (1000M) LAN and Modem are mounted. Bluetooth Depending on the model, the computer is equipped with a dedicated Bluetooth module. This enables a communication to devices that support Bluetooth Version 2.0.
1 Hardware Overview 1.1 Features S/PDIF This port can send or receive the digital sound data with the equipment like CD, MD Player. (This port is also used for headphone I/F.) Fingerprint sensor The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and the system units configuration.
1 Hardware Overview 1.2 1.2 System Block Diagram System Block Diagram Figure 1-2 shows the system block diagram.
1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. CPU Intel® CoreTM Duo processor CoreTM Duo -2M 1.66GHz (Processor Number : T2300) 1.83GHz (Processor Number : T2400) 2.00GHz (Processor Number : T2500) 2.16GHz (Processor Number : T2600) L1 cache : 64KB (32KB + 32KB) L2 cache : 2MB FSB : 667MHz Core voltage : 1.500~0.300V Intel® CoreTM Solo processor CoreTM Solo -1M 1.
1 Hardware Overview 1.2 System Block Diagram BIOS ROM (Flash memory) - 8Mbit (512K×16-bit chip) 288KB used for system BIOS 64KB used for VGA-BIOS 64KB used for Finger Print 32KB used for ACPI 24KB used for booting 16KB used for Parameter Block Others Chipset This gate array has the following elements and functions.
1.2 System Block Diagram 1 Hardware Overview PC card controller (PCI7412ZHK, Texas Instrument-made) - PCI Interface - PC Card/Ultra Media Controller - IEEE1394 Controller (2ports) - SD/MMC, MemoryStick, xD card Controller - 288-ball 16mm x 16mm x 1.
1 Hardware Overview 1.3 1.3 2.5-inch Hard Disk Drive 2.5-inch Hard Disk Drive Compact, high-capacity Serial-ATA HDD with a height of 9.5mm/12.5mm containing a 2.5inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the dimensions and specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Standard value Parameter FUJITSU G8BC0002W410 FUJITSU G8BC0002W610 FUJITSU G8BC0002W810 Width (mm) 70.0 Outline Height (mm) 9.
1.3 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD Specifications Specification Parameter Storage size (formatted) FUJITSU FUJITSU FUJITSU FUJITSU G8BC0002W410 G8BC0002W610 G8BC0002W810 G8BC0002WA10 40GB 60GB 80GB 100GB Speed (RPM) 5,400 Data transfer rate To/From media (MB/s) To/From host (Gbps) 61.3 max. 1.5 (150 MB/s) max. Data buffer size (MB) 8 Average seek time Read (ms) 12 typ. Motor startup time (s) 4 typ.
1 Hardware Overview 1.4 1.4 Optical Drive Optical Drive 1.4.1 DVD Super Multi Drive (supporting Double-Layer) The DVD Super Multi drive (supporting Double Layer) accommodates 12 cm (4.72-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD-ROM at maximum 24-speed.
1.4 Optical Drive 1 Hardware Overview Table 1-4 DVD Super Multi drive (Double-Layer) specifications Drive Specification Parameter MATSUSHITA (G8CC0002PZ20) DVD-ROM MAX 8x CAV CD-ROM MAX 24x CAV Read Data transfer speed Access time (ms) CD-R 24x (ZoneCLV) CD-RW 4x (CLV) High Speed CD-RW 10x (CLV) Ultra Speed CD-RW 16x (ZoneCLV) DVD-R 8x (ZoneCLV) DVD-R Dual Layer 2x (CLV) DVD-RW 4x (ZoneCLV) DVD+R 8x (ZoneCLV) DVD+R Dual Layer 2.
1 Hardware Overview 1.5 1.5 Keyboard Keyboard A keyboard which consists of 85(US)/86(UK) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-5 is a view of the keyboard. Figure 1-5 Keyboard See Appendix E for details of the keyboard layout.
1.6 TFT Color Display 1.6 1 Hardware Overview TFT Color Display The TFT color display is 15.4 inch and consists of LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,280 x 800 (WXGA) resolution. Figure 1-6 shows a view of the LCD module and Table 1-5 lists the specifications.
1 Hardware Overview 1.6 TFT Color Display 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-6 lists the FL inverter board specifications.
1.7 Power Supply 1.7 1 Hardware Overview Power Supply The power supply supplies 31 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
1 Hardware Overview 1.7 Power Supply Table 1-7 Power supply output rating (1/2) Power supply （Yes/No） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No Battery PPV 1.500 0.300 No No No CPU PTV 1.05 No No No CPU, MCH, GMCH, ICH7-M 1R5-P1V 1.5 No No No CPU, MCH, GMCH, ICH7-M, PCI-e Mini Card CRD1R5-P1V 1.5 No No No Express Card 1R8-B1V 1.8 Yes No No MCH, GMCH, DDR2-SDRAM 1R8-P1V 1.8 No No No GPU, VRAM 2R5-P2V 2.
1.7 Power Supply 1 Hardware Overview Table 1-7 Power supply output rating (2/2) Power supply（Yes/No） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No Battery BCAS-P5V 5 No No No BCAS M5V 5 Yes Yes No LED MCV 5 Yes Yes No PSC TUNER-P5V 5 No No No WW Tuner TUNER2-P5V 5 No No No ISDB-t Tuner SND-P5V 5 No No No AN12941A A4R7-P4V 4.7 No No No STAC9200, AN12941A R3V 2.0 -3.
1 Hardware Overview 1.8 1.8 Batteries Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-8 lists the specifications for these two batteries. Table 1-8 Battery specifications Battery Name G71C00063210 Main battery Battery Element Output Voltage Capacity Lithium ion 6 cell 10.8V 4,700mAh Lithium ion 9 cell 10.8V 7,050mAh Nickel hydrogen 2.4V 16mAh G71C00063110 G71C00064210 G71C00064110 Real time clock (RTC) battery GDM710000041 1.8.
1.8 Batteries 1 Hardware Overview 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-9.
1 Hardware Overview 1.8 Batteries 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-11 lists the Time required for charges of RTC battery and data preservation time.
1.9 AC Adapter 1.9 1 Hardware Overview AC Adapter The AC adapter is used to charge the battery. Table 1-12 lists the AC adapter specifications. Table 1-12 AC adapter specifications Item Specification G71C00043310 (2-pin) / G71C00049410 (3-pin) / G71C00049510 (3-pin) Power 75W (Peak 90W) Input voltage AC 100V/240V Input frequency 50Hz/60Hz Input current 1.5A or less Output voltage 15.
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Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-8 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check ...........................
2 Troubleshooting Procedures 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 Display Troubleshooting.......................................................................................... 2-46 Procedure 1 External Monitor Check....................................................... 2-46 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-46 Procedure 3 Connector and Cable Check................................................. 2-47 Procedure 4 Replacement Check .........
2 Troubleshooting Procedures 2.18 Fingerprint sensor .................................................................................................... 2-63 Procedure 1 Setting Windows Log-ON password ................................... 2-64 Procedure 2 Registration of fingerprint.................................................... 2-64 Procedure 3 Authentication of fingerprint ............................................... 2-68 Procedure 4 Connector Check and Replacement Check...................
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2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. Power supply System Board USB FDD 2.5” HDD Keyboard Touch pad 7. 8. 9. 10. 11. 12. Display Optical Disk Drive Modem LAN Wireless LAN Bluetooth 13. 14. 15. 16.
2 Troubleshooting Procedures 2.1 Troubleshooting There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
2.2 Troubleshooting Flowchart 2.2 2 Troubleshooting Procedures Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows OS is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.
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2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If a malfunction is detected by the following items, perform the appropriate troubleshooting procedures follows. 1. If a malfunction is detected on the power supply, perform the Power Supply Troubleshooting Procedures in Section 2.3. 2. If a malfunction is detected on the TV turner, perform the TV turner Troubleshooting Procedures in Section 2.16. 3.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting Check 1 2 Troubleshooting Procedures Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Main Battery Error code Meaning 22h Main battery discharge current is over 0.5A. 23h Main battery charge current is over 4.3A. 24h Abnormal current has been sensed. 25h Main battery charge current is over 0.3A when the charging is off. 2nd Battery Error code Meaning 32h Second battery discharge current is over 0.5A. 33h Second battery charge current is over 4.3A. 34h Abnormal current has been sensed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E3V output Error code Meaning 60h E3V voltage is over 3.96V. 61h E3V voltage is under 2.81V when the computer is powered on. 62h E3V voltage is under 2.81V when the computer is booting up. 64h E3V voltage is under 2.81V when EV power is maintained. 1R5-E1V output Error code Meaning 70h 1R5-E1V voltage is over 1.80V. 71h 1R5-E1V voltage is under 1.275V when the computer is powered on. 72h 1R5-E1V voltage is under 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PTV output Error code Meaning A0h PTV voltage is over 1.26V. A1h PTV voltage is under 0.89V when the computer is powered on. A2h PTV voltage is under 0.89V when the computer is booting up. 1R5-E1V output Error code Meaning B0h 1R5-E1V voltage is over 1.80V. B1h 1R5-E1V voltage is under 1.275V when the computer is powered on. B2h 1R5-E1V voltage is under 1.275V when the computer is booting up. B4h 1R5-E1V voltage is under 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R5-P1V output Error code Meaning E0h 1R5-P1V voltage is over 1.80V. E1h 1R5-P1V voltage is under 1.248V when the computer is powered on. E2h 1R5-P1V voltage is under 1.248V when the computer is booting up. Miscellaneous Error code F0h Check 2 Meaning The sub clock does not oscillate. In the case of error code 10h or 12h: Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet.
2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN jack and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected: Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows OS is properly loaded, go to Procedure 4.
2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debugging Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Connect the debug port test cable to the connector CN3490 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (3/10) D port status F100h Inspection items Details Prohibition of cache Permission of L1/L2 cache in Flash ROM area Update of microcode Initialization of H/W (before DRAM recognition) Initialization of MCH Initialization of ICH.D30.Func0 Initialization of ICH.D31.Func0 Initialization of ICH.D31.Func1/2 Initialization of USB Controller Initialization of ICH.D31.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (5/10) D port status Inspection items (F106h) Details CPU clock measurement Check of parameter block A Permission of SMI except auto-off function Judging of destination (Japan or except Japan) based on DMI data Battery discharging current control (1CmA).
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (10/10) D port status Inspection items (F120h) Details Post processing of PRE_BOOT_SETUP Clears PWRBTN_STS Enables POWER Button F122h Initialization of SC F124h Clearness of IRT status Update of Checksum on Runtime side F1FFh End NOTE: Status outputted by the test means the last error detected in the debug port test.
2 Troubleshooting Procedures Procedure 3 2.4 System Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test [It is not supported] 7. Async test [It is not supported] 8. Hard Disk test 9. Real Timer test 10.
2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures 2 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 2 2.5 USB FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-5.
2.5 USB FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check USB FDD is connected to USB port on system board. The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 4 ports. (System board x 4 ports) Check 1 Make sure USB FDD is firmly connected to USB port.
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting Check 2 Connect USB FDD to other USB port and check if it works properly. If it does not work properly, perform Check 3 Check 3 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 4 Check 4 System board may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
2.6 2.5” HDD Troubleshooting 2.6 2 Troubleshooting Procedures 2.5” HDD Troubleshooting To check if the 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5”HDD troubleshooting procedures are executed.
2 Troubleshooting Procedures Procedure 2 2.6 2.5” HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 2.5” HDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C: /S/U. If the 2.
2 Troubleshooting Procedures Procedure 4 2.6 2.5” HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-6.
2.6 2.5” HDD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks. Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
2 Troubleshooting Procedures 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
2.7 Keyboard Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
2 Troubleshooting Procedures 2.8 2.8 Touch pad Troubleshooting Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
2.8 Touch pad Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the TP board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1.
2 Troubleshooting Procedures 2.9 2.9 Display Troubleshooting Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
2.9 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. In addition, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures Procedure 4 2.9 Display Troubleshooting Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1.
2.10 Optical Disk Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the Sound/LAN/Modem test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures Check 2 Modem cable or MDC cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedure. If the problem still occurs, perform Check 4. Check 4 System board may be faulty. Replace it with a new one following the instruction in Chapter 4, Replacement Procedure.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the Sound/LAN/Modem test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer’s Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas’ Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
2 Troubleshooting Procedures Procedure 2 2.13 Wireless LAN Troubleshooting Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
2.13 Wireless LAN Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting 2.14 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas’ Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position. If the switch is “Off”, turn it “On”.
2.14 Bluetooth Troubleshooting Procedure 2 2 Troubleshooting Procedures Antennas’ Connection Check The Bluetooth function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure that the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting Procedure 3 Replacement Check Bluetooth module, Bluetooth antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Bluetooth antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
2.15 Sound Troubleshooting 2 Troubleshooting Procedures 2.15 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check CAUTION: Sound test is not supported in this computer. So go to Procedure 2. Execute the Sound test in Sound/LAN/Modem test program.
2 Troubleshooting Procedures Procedure 3 2.15 Sound Troubleshooting Replacement Check If external microphone does not work properly, perform check 1. If headphone does not work properly, perform check 2. If internal microphone does not work properly, perform check 3. If speaker does not work properly, perform check 5. Check 1 External microphone may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 4.
2.16 TV tuner Troubleshooting 2 Troubleshooting Procedures 2.16 TV tuner Troubleshooting To check if TV tuner is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check The connection of cables, boards and module may be defective. Otherwise, they may be faulty.
2 Troubleshooting Procedures 2.17 Bridge media Slot Troubleshooting 2.17 Bridge media Slot Troubleshooting This section describes how to determine if the computer's Bridge media functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.18 Fingerprint sensor 2 Troubleshooting Procedures 2.18 Fingerprint sensor CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor work correctly or not, follow the troubleshooting procedures below as instructed. When failed in Procedure 1 to Procedure 3, execute Procedure 4.
2 Troubleshooting Procedures Procedure 1 2.18 Fingerprint sensor Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Select “Create a new account” in [User Account]. 3. Input the name of Account (e.g. “TOSHIBA”) in [Name the new account] and click [NEXT] button. 4. Click “Create Account” button in the (default) condition that the “Computer administrator” is selected in [Pick an account type]. 5. Select the icon of Account (e.g.
2.18 Fingerprint sensor 2 Troubleshooting Procedures 3. In the box of [Enter your password] on [User’s Password] display, input the password (e.g. password) which has been input in item 7 of Procedure1. Click [Next]. 4. After displaying [Enrollment Hints], check off in the box of [Run interactive tutorial] (when proceeding without seeing Tutorial). The display of “if you want really skip or not the Tutorial” appears, and then click [Skip Tutorial].
2 Troubleshooting Procedures 2.18 Fingerprint sensor 5. After displaying [User’s Fingerprint], click the box of thumb of right hand. A small window of “Swipe finger” appears, then swipe three times. 6. The display becomes as follows when the fingerprint is registered correctly. Click [Next].
2.18 Fingerprint sensor 2 Troubleshooting Procedures 7. After displaying [User Enrollment] dialog, you are asked if you want to register one more finger. Click [No] when you do not want to register one more. 8. When [Advanced Security] is displayed, click [Next]. 9. When [Finish] is displayed, click [Finish].
2 Troubleshooting Procedures 2.18 Fingerprint sensor 10. The display of “Protector Suite - QL Edition” appears in [Fingerprint Software] window, click [Close]. Procedure 3 Authentication of fingerprint 1. Turn on the computer. Windows starts up. 2. In the Windows Log-ON window, scan the fingerprint of registered finger. Make sure that a green check mark is displayed in the box (It means you have logged on).
2.18 Fingerprint sensor 2 Troubleshooting Procedures 3. After starting Windows, make sure that the name of Account (e.g. “TOSHIBA”), which has been inputted in item 3 in Procedure 1 at the top of [Start]. Procedure 4 Connector Check and Replacement Check The connector CN9540 on the FS board is connected to the connector CN9530 on the system board. Check 1 Check the FS cable is firmly connected to the connector CN9540 on the FS board and connector CN9530 on the system board. If not, connect it firmly.
2 Troubleshooting Procedures Check 4 2-70 2.18 Fingerprint sensor The system board may be faulty. Replace it with a new one.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
3 Tests and Diagnostics Chapter 3 3.1 3.2 3.3 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-2 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.21 3.22 3.23 3.24 3.25 3.26 ONLY ONE TEST................................................................................................... 3-47 3.21.1 Program Description .......................................................................... 3-47 3.21.2 Operations .......................................................................................... 3-47 Head Cleaning...............................................................................................
3 Tests and Diagnostics Tables Table 3-1 Subtest names .................................................................................................... 3-19 Table 3-2 Error codes and error status names .................................................................... 3-42 Table 3-3 Hard disk controller status register contents...................................................... 3-45 Table 3-4 HDC Error register contents ..............................................................................
3 Tests and Diagnostics 3-vi [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics 3.1 The Diagnostic Test REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) Sound/LAN/Modem/ TEST (Sound/LAN/Modem TEST disk) Bluetooth TEST (Bluetooth TEST disk) IEEE1394 TEST (IEEE1394 TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.3 Heatrun test program The heatrun test starts automatically after the selection. You will need the following equipment to perform this program.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Repair test program (Qosmio F30) --------------------------------------------------------1.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) Press 1 or select 1 with arrow keys and press Enter in the startup menu, and then the following menu appears. TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 2 3 4 5 6 7 8 9 – – DIAGNOSTIC TEST ONLY ONE TEST HEAD CLEANING LOG UTILITIES RUNNING TEST FDD UTILITIES SYSTEM CONFIGURATION POWER OFF NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE: Only when a 2nd HDD is installed in the computer, [There is a second hard disk] message appears in the display. Functions 1 through 12 are the Diagnostic Tests. Function 88 sets the floppy disk drive and hard disk drive error retry count (0-255). To exit the submenu of the Diagnostic Test and returns to the Diagnostics Menu, set the highlight bar to function 99 and press Enter. Select the option you want to execute and press Enter.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3 Tests and Diagnostics 3.3 3.3 Check of the RAID configuration Check of the RAID configuration Following screen is displayed for checking the RAID configuration and specifying a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1 DEGRADE xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3.3 Check of the RAID configuration 3 Tests and Diagnostics Logical Drive Information: Displays logical drive number, RAID level, RAID status, contents and setting. Physical Drive Information: Displays port number, logical drive number belonged, status and disk information. RAID level: Displays RAID level configured. NON: Means that RAID is not configured. Confirming the physical drive information can check if a drive exists and check models of the drive. RAID-0: There are 1RAID-0 and 2RAID-0 (striping).
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.2 Check of the screen display Contents of the screen displayed are shown below. 3.3.2.1 RAID-1 When the “RAID-1” is displayed in the configured by two drives. shown below, it is judged that the RAID is TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3.3 Check of the RAID configuration 3 Tests and Diagnostics The RAID is not configured by two drives in the following display, because there are two LDs (LD0 and LD1). TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-0 OPTIMAL Capacity xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.3 Specification of the failed HDD Check the RAID configuration condition from the failed drive. shown below and specify a TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-1 DEGRADE Capacity xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.3.2 RAID : not OPTIMAL ABSENT or OFFLINE is displayed When the “ABSENT” or “OFFLINE” is displayed as shown below, the drive is removed by the RAID console and installed again. When the drive is unlocked, “ABSENT” is displayed. When the drive is locked, “OFFLINE” is displayed. Repair is not needed in this case. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3 Tests and Diagnostics 3.3 Check of the RAID configuration NO DRIVE for one drive is displayed When “NO DORIVE” is displayed and the HDD is connected to the port, follow the procedures below to check the HDD failure. (1) Install a new HDD. When “NO DORIVE” is still displayed, It is judged that the MB or cable fails. (2) When a new HDD is recognized, It is judged that the HDD removed is failed. Specify the reason by using the Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.
3.3 Check of the RAID configuration 3 Tests and Diagnostics FAIL for one drive is displayed One drive in the “RAID-1”is failed and degraded. This may look like failure by wrong operation. Specify the reason by using Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level LD0 RAID-1 Status Capacity DEGRADE xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.4 3.4 Setting of the hardware configuration Setting of the hardware configuration To execute this program, input 2 or select 1 with arrow keys in the startup menu. Then press Enter to select the (2)-Repair initial config set. The H/W initial information setting tool consists of four subtests. Input the number you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3.4 Setting of the hardware configuration 3 Tests and Diagnostics Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 03 DMI information save NOTE: Before replacing the system board, be sure to execute this subtest and save the DMI information to the floppy disk.
3 Tests and Diagnostics 3.5 3.5 Heatrun Test Heatrun Test To execute this program, input 3 or select 3 with arrow keys in the startup menu. Then press Enter to select the (3)-Repair heatrun. After selecting this test, the same subtests as 3.24 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3.6 Subtest Names 3.6 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. Test Name Subtest No.
3 Tests and Diagnostics 3.6 Subtest Names Table 3-1 Subtest names (2/2) No. 3-20 Test Name Subtest No.
3.7 System Test 3.7 3 Tests and Diagnostics System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3 Tests and Diagnostics 3.7 System Test If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. If the CPU does not support Gerserville (SpeedStep), the following message is displayed and the test is ended. This chip is not supported Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3.8 Memory Test 3.8 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.9 3.9 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3.10 Display Test 3 Tests and Diagnostics 3.10 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.10 Display Test Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3.10 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.11 Floppy Disk Test 3.11 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested, then press Enter.
3.11 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.12 Printer Test 3.12 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3.12 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3 Tests and Diagnostics 3.13 Async Test 3.13 Async Test CAUTION: Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.14 Hard Disk Test 3 Tests and Diagnostics 3.14 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
3 Tests and Diagnostics 3.14 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3.14 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.15 Real Timer Test 3 3.15 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3.15 Real Timer Test Subtest 03 3 Tests and Diagnostics Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
3 Tests and Diagnostics 3.16 NDP Test 3.16 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. CAUTION: Judge the existence of high-speed operation processor by 1bit of the composition byte. If exists, the bit is “1”. Test only when the high-speed operation processor exists.
3.17 Expansion Test 3 Tests and Diagnostics 3.17 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 02 3.17 Expansion Test RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID (Extended Display Identification Data) is required. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command. CAUTION: It becomes NG because the priority is given to the internal monitor in a simultaneous display mode.
3.18 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.18 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3 Tests and Diagnostics 3.19 Error Code and Error Status Names 3.19 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.
3 Tests and Diagnostics 3.
3.20 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status Tables 3-4 HDC Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3.21 ONLY ONE TEST 3.21 3 Tests and Diagnostics ONLY ONE TEST 3.21.1 Program Description This program tests the unique functions of this model. 3.21.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (QOSMIO F30) ######## ################################################################ * * * 1 ............ Pressed Key Display * * 2 ............
3 Tests and Diagnostics Subtest 01 3.21 ONLY ONE TEST Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
3.21 ONLY ONE TEST Subtest 02 3 Tests and Diagnostics Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3 Tests and Diagnostics Subtest 03 3.21 ONLY ONE TEST Kill Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Kill switch is set to a start position (OFF) Slide the switch to OFF position. Then, following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position. Then, following message appears in the display.
3.21 ONLY ONE TEST 3 Tests and Diagnostics NG message appears in the display if a defective is found during the test. Confirm the connection of cable, then execute the test again. Press 9 and return to ONLY ONE TESST menu. Subtest 05 LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly.
3 Tests and Diagnostics Subtest 06 3.21 ONLY ONE TEST Button This subtest checks if the Operation buttons (11 buttons) work properly. The following message appears in the display. 0 1 2 3 4 5 6 7 8 9 A * * * * * * * * * * * Press Function button ! Press the first Operation button from the left (The first * from the left is lighted in green.). The name of Operation button in the message is described as number (0-A) from the left side. (Refer to the following picture.
3.21 ONLY ONE TEST Subtest 07 3 Tests and Diagnostics Remocon (Remote control, [AUDIO/STOP]) This subtest checks if AUDIO/STOP button of attached remote controller works properly. The following message appears in the display. [[[Remote Control test]]] Press [AUDIO/STOP] button! Press AUDIO/STOP button of the remote controller and return to the ONLY ONE TEST menu.
3 Tests and Diagnostics 3.22 3.22 Head Cleaning Head Cleaning 3.22.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.22.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.23 Log Utilities 3.23 3 Tests and Diagnostics Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3 Tests and Diagnostics 3.23 Log Utilities 3.23.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3.24 Running Test 3.24 3 Tests and Diagnostics Running Test 3.24.1 Function Description Some devices are tested in an attended operation. The name of tested devices and subtest number are displayed on the screen while executing the test. This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) 6.
3 Tests and Diagnostics 3.25 3.25 Floppy Disk Drive Utilities Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No.
3.26 System Configuration 3 Tests and Diagnostics 3 3.26 System Configuration 3.26.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC/KBC version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9.
3 Tests and Diagnostics 3.26 System Configuration 3.26.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] * * * * * * * * * * * * * * * * * * * - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VRAM = XXXXMB BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX EC/KBC Version = VX.XX PS Micon Version = VX.XX SVP Par.
3.27 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Atheros) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros 11a/g(MB44ag)/Atheros 11a/g(MB62HL)) that can communicate by the wireless LAN as a responder machine to perform this test. The computer must be booted by the Responder T&D.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Atheros) 3.27.1 Setting the responder machine 1. MB44ag is installed 1) Boot the computer by MB4x Responder media. 2) The Responder T&D is automatically started. 2. MB6x is installed As the capacity of MB6x T&D is over the one of a FD, a RAM drive is used. 1) Boot the computer by MB6x Responder media. 2) After starting the OS, following message is displayed. input m and press Enter.
3.27 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics 6) When the file copy is completed, the following test menu is displayed. Press r. The Responder T&D is started. ************************************************************ * * * Atheros MB6x DUT mode Maintenance T&D Menu * * * * d : DUT mode * * * * r : Responder mode * * * ************************************************************ SELECT MODE No.(d or r) : 3.27.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Atheros) 5) When the file copy is completed, the following test menu is displayed. Press d. The Responder T&D is started. ************************************************************ * * * Atheros MB6x DUT mode Maintenance T&D Menu * * * * d : DUT mode * * * * r : Responder mode * * * ************************************************************ SELECT MODE No.(d or r) : 6) The following test menu is displayed. Select the test number.
3.27 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics When an error (read error of EEPROM date) has detected, the following is displayed. ------------ERROR-----------file bac.txt cannot be opened 2. MAC Address Check The MAC address of the installed Wireless LAN card is checked. If it is not incorrect MAC address, the following is displayed. ************************************ * * * MAC Address Check : OK !! * * * ************************************ a.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Atheros) When an error has detected, the following is displayed. ************************************** * * * 11a Communication Test : NG !! * * * * Please refer to log.txt * * * ************************************** 4. Communication test of 11b mode The check of connection of 11b mode antenna and transmitting/receiving test are executed. When the test has been finished normally, the following is displayed.
3.27 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics 6. SKU & MAC Check 11a/b/g communication test All the test is executed in the order of SKU check of Module, MAC Address Check, Communication test of 11a mode, Communication test of 11b mode and Communication test of 11g mode. The check of connection of 11g mode antenna and transmitting/receiving test are executed.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) 3.28 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again.
3 Tests and Diagnostics Subtest03 3.28 Wireless LAN Test Program (Intel-made a/b/g) Antenna check & communication test of 11b mode This subtest execute transmitting/receiving test in 802.11b mode using the main antenna first. If a defective is not found during the test, transmitting/receiving test in 802.11b mode using the AUX antenna is automatically executed. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu.
3.28 Wireless LAN Test Program (Intel-made a/b/g) Subtest05 3 Tests and Diagnostics Communication test of 11g mode This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
3 Tests and Diagnostics 3.29 Sound/LAN/Modem Test Program 3.29 Sound/LAN/Modem Test Program To execute the Sound/LAN/Modem Test, use the Sound/LAN/Modem test program disk. Finish the tests of the Diagnostics disk by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS. Install the contents of Sound/LAN/Modem test program of the FDD into a HDD and make a dedicated test system that can boot from “C” drive.
3.29 Sound/LAN/Modem Test Program 3 Tests and Diagnostics Press any key, and the following message appear. The sound is recorded for five seconds automatically from the microphone. ....Press test number[1-4] ? call micrec (Omission on the way) Recorded from source name is MIC Requested Sampling Rate is 22025Hz Volume requested is 0.000 dB Record to buffer is BUFFER0 Record Time requested is 5.0000 seconds Actual record time will be 5.
3 Tests and Diagnostics Subtest 02 3.29 Sound/LAN/Modem Test Program Sin wave When the subtest is executed, the following message appears. ....Press test number[1-4] ? pause Press any key to continue... When the beep sound finished, the screen returns to the main menu and the following massage appears. ....Press test number [1-4] ? To execute a subtest continuously, select the test number and press Enter.
3.29 Sound/LAN/Modem Test Program Subtest 04 3 Tests and Diagnostics MODEM For this subtest, connect the modem PCB and RJ11 connector with a harness. This subtest contains the following tests. They are tested with the dedicated FAT-MODE inspection device (Product Code QE2000P01 made by Nittou Denki Seisakusyo). (a) Select 4 to execute and press Enter. The following message will appear: [Modem loopback test!] ICHX MDC Test Program with Modem Sound ( Line Test ) Version X.
3 Tests and Diagnostics 3.30 IEEE 1394 Test Program 3.30 IEEE 1394 Test Program To execute the IEEE 1394Test, use the IEEE 1394 Test program disk. Finish the tests of the Diagnostics disk (No.1) by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS. Insert the IEEE 1394 Test program disk in the floppy disk drive and turn on the power.
3.31 Bluetooth Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.31 Bluetooth Test program This section describes how to perform the Bluetooth test program to check if the Bluetooth functions of computer are working properly. To start the Bluetooth test program, follow the steps below: NOTE: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test.
3 Tests and Diagnostics Subtest 01 3.31 Bluetooth Test program BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.31 Bluetooth Test program 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.31 Bluetooth Test program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure. Page Timeout.
3.31 Bluetooth Test program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed. Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist See the Specification of the Bluetooth System in detail.
3 Tests and Diagnostics 3.31 Bluetooth Test program When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.31 Bluetooth Test program 3 Tests and Diagnostics If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.31 Bluetooth Test program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f 3-88 Meaning Unknown HCI Command. No Connection. Hardware Failure.
3.31 Bluetooth Test program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.31 Bluetooth Test program Table 3-8 Common Error code Error code Meaning 0x30 BT Control Status is not “Disable”. 0x31 BT Control Status is not “Enable”. 0x32 Power Status is not “OFF”. 0x33 Power Status is not “ON”. 0x34 USB I/F Status is not “Attach”. 0x35 USB I/F Status is not “Detach”. 0x36 Wake-up Status is “assert” 0x37 Wake-up Status is not “assert”. 0x38 Switch Status is “ON”. 0x39 Switch Status is “OFF”. 0x3a Module does no exist.
3.32 SETUP 3 Tests and Diagnostics 3.32 SETUP 3.32.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM (c) Enhanced C-States 4. Password 5. HDD Password (a) HDD (b) HDD Password Mode (c) User Password (d) Maser Password 6. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 7.
3 Tests and Diagnostics 3.32 SETUP 11. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 12. Peripheral (a) Internal Pointing Device 13. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 14. PCI LAN 15.
3.32 SETUP 3 Tests and Diagnostics 3.32.2 Accessing the SETUP Program While pressing ESC, turn on the power. Then press F1. The following display appears.
3 Tests and Diagnostics 3-94 [CONFIDENTIAL] 3.
3.32 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.32 SETUP SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3.32 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High Low CPU operates at high speed. (Default in Full Power Mode) CPU operates at low speed.
3 Tests and Diagnostics 3.32 SETUP Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on. When the CPU temperature falls to a normal range, the fan is turned off and the processing speed is increased. NOTE: Too hot condition may cause defect on the CPU. When the hot condition continues, the power is automatically turned off in resume mode.
3.32 SETUP 3 Tests and Diagnostics 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password is selected. When the second HDD is mounted, “Second HDD” can be selected. Built-in HDD The password is set to Built-in HDD. (This cannot be changed, when the second HDD is not mounted.) Second HDD The password is set to Second HDD. (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password.
3 Tests and Diagnostics 3.32 SETUP 6. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting. FDD→HDD→CD-ROM→LAN: The computer looks for bootable files in the following order: FDD, HDD, CDROM (*1) and LAN HDD→CD-ROM→LAN→FDD: The computer looks for bootable files in the following order: HDD, CD-ROM, LAN and FDD. FDD→CD-ROM→LAN→HDD: The computer looks for bootable files in the following order: FDD, CD-ROM, LAN and HDD.
3.32 SETUP 3 Tests and Diagnostics Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Core-Multi Processing The Core Multi-Processing sets the CPU operating mode. The configuration for the Core Multi - Processing is carried out in the BIOS setup program. Enabled is Dual Core mode. Disabled is Single Core mode. Enabled Enables Core Multi-Processing functions.
3 Tests and Diagnostics 3.32 SETUP (d) Virtualization Technology Virtualization Technology sets enable or disable of the Intel Virtualization Technology installed in the CPU. Intel Virtualization Technology is the technique that allows one machine to operate as multiple virtual machines. Enabled Enables Virtualization Technology. Disabled Disables Virtualization Technology. (Default) (e) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set.
3.32 SETUP 3 Tests and Diagnostics NOTE: 1. Do not remove the AC adaptor and battery pack at the same time when you use this feature. If you do so, data saved by the resume function will be lost. You must also reset this option. 2. If you have set a password and the computer boots by the Auto Power On function and Standby is on, the computer will start with the instant security function enabled. The password = message is not displayed; however, you must enter the password to use the computer. 3.
3 Tests and Diagnostics 9. 3.32 SETUP Drives I/O This option displays the address and interrupts level for hard disk drive and optical disk drive. It is for information only and cannot be changed. Built-in HDD 1 Displays the setting of the HDD1 address. This cannot be changed. Built-in HDD 2 Displays the setting of the HDD2 address. This cannot be changed. CD-ROM Displays the setting of the drive address and interrupt level. This cannot be changed. 10.
3.32 SETUP 3 Tests and Diagnostics 11. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD. (Default) LCD+AnalogRGB Selects both the internal LCD and the external CRT for simultaneous display. NOTE: 1. When starting the computer in Standby or Hibernation, the last configuration is remembered.
3 Tests and Diagnostics 3.32 SETUP 12. Peripheral Use this option to select the peripheral’s mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. 13. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver.
3.32 SETUP 3 Tests and Diagnostics 15. RAID ARRAY This option sets the RAID configuration. (a) Current State This option indicates the current hard disk condition. Content set in [Create State] is displayed, when booting BIOS setup next time. Built in HDD1 Displays RAID configuration level of the built-in HDD1. Built in HDD2 Displays RAID configuration level of the built-in HDD2. (b) Create State This option sets the RAID configuration level.
3 Tests and Diagnostics 3.33 Thermal Radiation Control Test 3.33 Thermal Radiation Control Test This thermal radiation control test checks the temperature of the CPU and GPU. To execute this test, use the diagnostics disk (Thermal radiation control) and follow the procedures below. 1. Turn on the computer and start the Windows. 2. Insert the diagnostic disk for the thermal radiation control test to the USB FDD. 3. Open the [EXPLORE] window and double-click the [THERMAL.bat] file in the diagnostic disk. 4.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4 4-ii [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
4 Replacement Procedures Chapter 4 Contents 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card/Bridge media .............................................................................................. 4-10 4.3.1 PC card ......................................................
4 Replacement Procedures 4.27 CPU fan/CPU heat sink/CPU .................................................................................. 4-61 4.28 GPU heat sink .......................................................................................................... 4-65 4.29 North bridge heat sink.............................................................................................. 4-67 4.30 PC card slot ....................................................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing the battery ......................................................................................... 4-9 Figure 4-3 Removing the PC card ..................................................................................... 4-10 Figure 4-4 Removing the Bridge media.......................................................................
4 Replacement Procedures Figure 4-32 Removing the Jack board ................................................................................. 4-51 Figure 4-33 Removing the system board ............................................................................. 4-52 Figure 4-34 Removing the DC-IN jack ............................................................................... 4-53 Figure 4-35 Removing the speaker ......................................................................................
4 Replacement Procedures Figure 4-64 to 4-68 Replacing 15.4 inch Samsung fluorescent lamp......................
4 Replacement Procedures 4-viii [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
4.1 Overview 4 Replacement Procedures 4 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N·m (1.7 kgf·cm) • M2.5 (2.5mm) 0.294 N·m(3.0 kgf·cm) • M3.0 (3mm) 0.549 N･m (5.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw (BIND screw) F: Flat head bind screw (FLAT BIND) S: Super thin head screw (S-THIN HEAD) T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1 and 42). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
4.2 Battery pack 4 Replacement Procedures 6. Separate the battery cover and battery while releasing the hooks of the battery cover. Battery cover Battery Hook Figure 4-2 Removing the battery NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for installing the battery pack (See Figure 4-1 and 4-2).
4 Replacement Procedures 4.3 4.3 PC card/Bridge media PC card/Bridge media 4.3.1 PC card Removing the PC card The following describes the procedure for removing the PC card (See Figure 4-3). CAUTION: Insert or remove the PC card in accordance with any instructions in their manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it, and then press the eject button once more to eject PC card. 2. Grasp the PC card and remove it.
4.3 PC card/Bridge media 4 Replacement Procedures 4.3.2 Bridge media (SD Card/Memory Stick/xDPicture Card/MultiMedia card) Removing the Bridge media The following describes the procedure for removing the Bridge media (See Figure 4-4). CAUTION: Insert or remove a Bridge Media in accordance with any instructions in the each Bridge Media manual or the manuals of the computer system you are using. 1. Push the Bridge media. It will pop out partly when you release, so pull out the card.
4 Replacement Procedures 4.4 4.4 HDD HDD Removing the HDD The following describes the procedure for removing the HDD (See Figure 4-5 to 4-7). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Loosen the following screw (with e-ring) and remove the HDD-1 slot cover. 3. Remove the following screw securing the HDD-1 assembly. • M2.5×6B FLAT BIND screw ×１ 4.
4.4 HDD 4 Replacement Procedures 5. (When the HDD-2 is installed,) Loosen the screw (with e-ring) and remove the HDD-2 slot cover. 6. With holding the tab of the HDD-2 assembly, lift HDD-2 assembly straight up and away from the connector on the system board.
4 Replacement Procedures 4.4 HDD 7. Remove the following screws and separate the HDD holder from the HDD assembly. • M3.0×4S S-THIN HEAD screw ×4 M3.0x4S S-THIN HEAD M3.
4.4 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for installing the HDD (See Figure 4-5 to 4-7). 1. Install the HDD to the HDD holder and secure it with the following screws. • M3.0×4S S-THIN HEAD screw ×4 NOTE: Although they are 3mm head screws, screw torque must be set in 0.294 N·m (3.0Kgf·cm) for four screws securing the HDD holder. 2. Insert the HDD-2 assembly into the HDD-2 slot and connect the connector carefully to the connector on the system board. 3.
4 Replacement Procedures 4.5 4.5 Memory module Memory module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing the memory module with the power on damages the module or the computer itself. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Removing the memory module To remove the memory module, confirm that the computer is in boot mode.
4.5 Memory module 4 Replacement Procedures Installing the memory module Before installing the memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8). 1. Insert the memory module firmly into the connector of the computer slantwise and press down it. CAUTION: Be sure to install a memory module to slot A (CN1400). The computer does not boot when a memory module in installed into slot A.
4 Replacement Procedures 4.6 4.6 Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-9 and 4-10). CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Insert your finger into the slot between the keyboard holder and computer. Then lift up the keyboard holder while unlatching. 2. Remove the following screw. • M2.5×4B FLAT BIND screw ×2 3.
4.6 Keyboard 4 Replacement Procedures 4. Remove the following screw and keyboard support plate. • M2.5×8B FLAT BIND screw ×1 5. Disconnect the keyboard cable from the connector CN3200 on the system board and remove the keyboard. M2.
4 Replacement Procedures 4.6 Keyboard Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-9 to 4-10). 1. Place the keyboard on the palm rest with its face down. Connect the keyboard cable to the connector CN3200 on the system board. 2. Install the keyboard support plate and secure it with the following screw. • M2.5×8B ×1 FLAT BIND screw 3. Turn the keyboard face up and put it on the computer.
4.7 MDC 4.7 4 Replacement Procedures MDC Removing the MDC The following describes the procedure for removing the MDC (See Figure 4-11). 1. Remove the following screws securing the MDC. • M2.0×4B ×2 BIND screw 2. Pull the MDC straight up and disconnect the MDC from the connector CN3010 on the system board. CAUTION: Be sure to pull the MDC straight up carefully, or the connector may be damaged. 3. Disconnect the modem cable from the connector on the MDC. M2.
4 Replacement Procedures 4.7 MDC Installing the MDC The following describes the procedure for installing the MDC (See Figure 4-11). 1. Connect the modem cable to the connector on the MDC. 2. Install the MDC and connect it to the connector CN3010 on the system board. CAUTION: Be sure to install the MDC straight down carefully fitting the connectors of the MDC and system board, or the connectors may be damaged. 3. Secure the MDC with the following screws. • M2.
4.8 Wireless LAN card 4.8 4 Replacement Procedures Wireless LAN card Removing the wireless LAN card The following describes the procedure for removing the wireless LAN card (See Figure 4-12). 1. Remove the following screw and wireless LAN card hold plate. • M2.0×4B TORX or BIND screw ×1 2. Disconnect the wireless LAN antenna cables (MAIN & AUX) from the terminals on the wireless LAN card. 3. Remove the following screws securing the wireless LAN card. • M2.0×4B ×2 BIND screw 4.
4 Replacement Procedures 4.8 Wireless LAN card Installing the wireless LAN card The following describes the procedure for installing the wireless LAN card (See Figure 4-12). 1. Insert slantwise the wireless LAN card firmly into the connector CN2600 on the system board. 2. While holding down, secure the wireless LAN card with the following screws. • M2.0×4B ×2 BIND screw 3. Connect the wireless LAN antenna cables to the terminals (White cable to MAIN, Black cable to AUX) on the wireless LAN card. 4.
4.9 Bluetooth module 4.9 4 Replacement Procedures Bluetooth module Removing the Bluetooth module The following describes the procedure for removing the Bluetooth module (See Figure 4-13). 1. Disconnect the Bluetooth antenna cable from the connector on the Bluetooth module. 2. Push the stopper in the direction of the arrow to unlatch and take out the Bluetooth module from the slot. 3. Disconnect the Bluetooth flat cable from the connector on the Bluetooth module. 4.
4 Replacement Procedures 4.9 Bluetooth module Installing the Bluetooth module The following describes the procedure for installing the Bluetooth module (See Figure 4-13). 1. Connect the Bluetooth flat cable to the connector CN4400 on the system board. 2. Connect the Bluetooth flat cable to the connector on the Bluetooth module. 3. Install the Bluetooth module to the slot. 4. Connect the Bluetooth antenna cable to the connector on the Bluetooth module.
4.10 Cover assembly 4.10 4 Replacement Procedures Cover assembly Removing the Cover assembly The following describes the procedure for removing the cover assembly (See Figure 4-14 to 4-18). 1. Turn over the computer and disconnect the GPU fan cable from the connector CN8781 on the system board. 2. Disconnect the AV-IN cable from the connector PJ650 on the analog TV tuner. 3. Remove the following screws and ODD slot bezel. • M2.
4 Replacement Procedures 4.10 Cover assembly 4. Remove the following screws securing the cover assembly. • M2.5×4B FLAT BIND screw ×3 (Described as "4" in the figure) • M2.5×8B FLAT BIND screw ×4 (Described as "8" in the figure) • M2.
4.10 Cover assembly 4 Replacement Procedures 5. Turn the computer face up and remove the LCD connector cover. 6. Disconnect the LCD cable from the connector CN5500 on the system board.
4 Replacement Procedures 4.10 Cover assembly 7. Disconnect the touch pad cable from the connector CN3201 on the system board. 8. Disconnect the volume cable from the connector CN3330 on the system board. 9. Disconnect the fingerprint sensor cable from the connector CN9530 on the system board. 10. Disconnect the switch cable from the connector CN9650 on the system board. 11. Peel off the insulator and release the Bluetooth antenna cable. 12.
4.10 Cover assembly 4 Replacement Procedures 13. Remove the cover assembly while releasing the latches.
4 Replacement Procedures 4.10 Cover assembly Installing the cover assembly The following describes the procedure for installing the cover assembly (See Figure 4-14 to 4-18). 1. Install the cover assembly to the base while engaging latches. 2. Connect the LED cable to the connector CN9500 on the system board. 3. Arrange the Bluetooth antenna cable in place and stick the insulator. 4. Connect the switch cable to the connector CN9650 on the system board. 5.
4.11 Touch pad 4 Replacement Procedures 4 4.11 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-19 to 4-21). 1. Remove the following screw on the back side of the cover assembly. • M2.5×4B FLAT BIND screw ×1 2. Remove the touch pad assembly while sliding it in the direction of the arrow. M2.
4 Replacement Procedures 4.11 Touch pad 3. Open the insulator A to which the double-sided tape is stuck and disconnect the touch pad cable from the TP board. 4. Turn up the insulator B and disconnect the button cable from the touch pad assembly. 5. Disconnect the button cable from the TP board.
4.11 Touch pad 4 Replacement Procedures 6. Turn over the touch pad assembly and remove the following screw and TP board. • M1.8×3S ×1 S-THIN HEAD screw M1.
4 Replacement Procedures 4.11 Touch pad Installing the touch pad The following describes the procedure for installing the touch pad (See Figure 4-19 to 4-21). 1. Install the TP board to the touch pad and secure it with the following screw. • M1.8×3S S-THIN HEAD screw ×1 NOTE: When installing the TP board, insert the dent of the TP board under the guide and slide the TP board to the rib. Rib Guide 2. Turn up the insulator B and connect the button cable to the connector on the touch pad and TP board.
4.12 LED board 4.12 4 Replacement Procedures LED board Removing the LED board The following describes the procedure for removing the sound board (See Figure 4-22). 1. Remove the following screw securing the LED board. • M2.5×4B FLAT BIND screw ×1 2. Remove the LED board upward from the cover assembly. 3. Disconnect the LED cable from the connector CN9510 on the LED board. LED cable M2.
4 Replacement Procedures 4.12 LED board Installing the LED board The following describes the procedure for installing the LED board (See Figure 4-22). 1. Connect the LED cable to the connector CN9510 on the LED board. 2. Install the LED board to the cover assembly. NOTE: Pass the LED cable through the hole of the cover assembly. Install the LED board according to the position of the wireless communication switch. LED cable Wireless communication switch 3. Secure the LED board with the following screw.
4.13 Fingerprint sensor board 4 Replacement Procedures 4.13 Fingerprint sensor board Removing the Fingerprint sensor board The following describes the procedure for removing the fingerprint sensor board (See Figure 4-23). 1. Push down the latch and slide the fingerprint sensor holder in the direction of arrow in the following figure to remove it. 2. Remove the fingerprint sensor board from the cover assembly. 3.
4 Replacement Procedures 4.13 Fingerprint sensor board Installing the Fingerprint sensor board The following describes the procedure for installing fingerprint sensor board (See Figure 423). 1. Connect the fingerprint sensor cable to the connector CN9540 on the fingerprint sensor board. 2. Install the fingerprint sensor board to the cover assembly. 3. Install the fingerprint sensor holder in place and slide it in the opposite direction of arrow in the figure 4-23 while pushing down the latch.
4.14 Volume board 4 Replacement Procedures 4.14 Volume board Removing the Volume board The following describes the procedure for removing the volume board (See Figure 4-24). 1. Peel off the glass tape and remove the volume holder (with the volume board) from the cover assembly while expanding outward the projections of the volume holder. 2. Separate the volume board and volume holder. 3. Remove the volume knob under the base assembly while releasing two latches.
4 Replacement Procedures 4.15 Switch membrane 4.15 Switch membrane Removing the Switch membrane The following describes the procedure for removing the switch membrane (See Figure 4-25 and 4-26). 1. Push the projections and remove the switch membrane assembly in the direction of the arrow in the following figure.
4.15 Switch membrane 4 Replacement Procedures 2. Push the latch and slide the switch membrane in the direction of the arrow in the following figure to remove it from the membrane frame assembly. Switch membrane Membrane frame assembly Latch Figure 4-26 Removing the switch membrane (2) Installing the Switch board The following describes the procedure for installing the switch board (See Figure 4-25 and 426). 1.
4 Replacement Procedures 4.16 4.16 Wireless communication switch Wireless communication switch Removing the Wireless communication switch The following describes the procedure for removing the wireless communication switch. 1. Remove the wireless communication switch from the cover assembly by pushing it from the inside of the cover assembly. Installing the Wireless communication switch The following describes the procedure for installing the wireless communication switch. 1.
4.17 Optical disk drive 4 Replacement Procedures 4.17 Optical disk drive CAUTION: Do not perform 4.17.2 “Ejecting the optical disk” except for the emergency ejection of optical disk inside ODD. 4.17.1 Replacing the optical disk drive Removing the optical disk drive The following describes the procedure for removing the optical disk drive (See Figure 4-27 and 4-28). 1. Pull out the ODD assembly from the connector CN1810 on the system board.
4 Replacement Procedures 4.17 Optical disk drive 2. Remove the following screw securing the ODD side bracket and remove the ODD side bracket. • M2.0×3S S-THIN HEAD screw ×1 3. Remove the following screws securing the ODD rear bracket. • M2.0×2.7B S-THIN HEAD screw ×2 4. Remove the ODD rear bracket from the ODD assembly. ODD side bracket ODD rear bracket M2.0x2.7B S-THIN HEAD M2.
4.17 Optical disk drive 4 Replacement Procedures 4.17.2 Ejecting the optical disk CAUTION: The following procedure is emergency cope only when the optical disk inside ODD (here, refers DVD super multi drive to DVD) can not be ejected because of some failure. Disassembling the ODD drive assembly The following describes the procedure for ejecting the optical disk from the optical disk drive (See Figure 4-29). 1. Remove the following screws securing the ODD cover. • M1.8×2C S-THIN HEAD screw ×4 2.
4 Replacement Procedures 4.17 Optical disk drive Assembling the ODD assembly The following describes the procedure for assembling the ODD assembly from the optical disk drive (See Figure 4-29). 1. Install the ODD cover to the ODD base assembly by sliding the hook into the slot of ODD base assembly. 2. Secure the ODD cover with the following screws. • M1.
4.18 RTC battery 4 Replacement Procedures 4.18 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery (See Figure 4-30). 1. Disconnect the RTC battery cable from the connector CN9990 on the system board. 2. Peel off the glass tape and remove the RTC battery from the slot.
4 Replacement Procedures 4.19 Internal microphone 4.19 Internal microphone Removing the Internal microphone The following describes the procedure for removing the internal microphone (See Figure 431). 1. Peel off the glass tape. 2. Disconnect the microphone cable from the connector CN6050 on the jack board and remove the internal microphone from the microphone holder.
4.20 Jack board 4 Replacement Procedures 4.20 Jack board Removing the Jack board The following describes the procedure for removing the Jack board (See Figure 4-32). 1. Disconnect the analog TV turner cable from the connector CN9614 on the Jack board. 2. Disconnect the Jack cable from the connector CN6500 on the system board and connector CN6510 on the Jack board. 3. Take out the Jack board from the slot of the base assembly.
4 Replacement Procedures 4.21 System board/DC-IN jack 4.21 System board/DC-IN jack CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.4 “Setting of the hardware configuration”. Also update with the latest BIOS and EC/KBC as described in Appendix G and in Appendix H.
4.21 System board/DC-IN jack 4 Replacement Procedures 4. Remove the DC-IN jack from the connector CN8800 on the system board. DC-IN jack CN8800 (Back of the system board) Figure 4-34 Removing the DC-IN jack Installing the system board/DC-IN jack The following describes the procedure for installing the system board/DC-IN jack (See Figure 4-33 and 4-34). 1. Connect the DC-IN jack to the connector CN8800 on the system board. 2.
4 Replacement Procedures 4.22 Speaker 4.22 Speaker Removing the speaker The following describes the procedure for removing the speaker (See Figure 4-35). 1. Take out the analog TV tuner cable from the slot. 2. Peel off five glass tapes and remove the speakers from the slot of the base assembly. Speaker Analog TV tuner cable Glass tape Glass tape Speaker Figure 4-35 Removing the speaker Installing the speaker The following describes the procedure for installing the speaker (See Figure 4-35). 1.
4.23 Modem jack/F jack 4.23 4 Replacement Procedures Modem jack/F jack Removing the Modem jack/F jack The following describes the procedure for removing the modem jack/F jack (See Figure 4-36 and 4-37). 1. Take out the modem jack from the slot.
4 Replacement Procedures 4.23 Modem jack/F jack 2. Push the F jack in the direction of arrow in the following figure and take it out from the slot. 3. Disconnect the TV antenna cable from the F jack. TV antenna cable F jack Figure 4-37 Removing the F jack Installing the Modem jack/F jack The following describes the procedure for installing the Modem jack/F jack (See Figure 4-36 and 4-37). 1. Connect the TV antenna cable to the F jack and install the F jack into the slot. 2.
4.24 GPU Fan 4 Replacement Procedures 4.24 GPU Fan Removing the GPU fan The following describes the procedure for removing the GPU fan (See Figure 4-38). 1. Remove the GPU fan from the slot of the base assembly. GPU fan Figure 4-38 Removing the GPU fan Installing the GPU fan The following describes the procedure for installing the GPU fan (See Figure 4-38). 1. Install the GPU fan into the slot of the base assembly.
4 Replacement Procedures 4.25 4.25 Battery lock/Battery latch Battery lock/Battery latch Removing the Battery lock/Battery latch The following describes the procedure for removing the battery lock/battery latch (See Figure 4-39). 1. Remove the battery lock/latch assembly from the slot. 2. While unlatching the latches, separate the battery lock, battery latch and knob. NOTE: When removing the battery latch, be careful not to lose the spring.
4.25 Battery lock/Battery latch 4 Replacement Procedures Installing the Battery lock/Battery latch The following describes the procedure for installing the battery lock/battery latch (See Figure 4-39). 1. Install the battery latch and knob to the battery lock. NOTE: When installing the battery latch, make sure that the spring is in correct position. 2. Install the battery lock/latch assembly into the slot.
4 Replacement Procedures 4.26 Analog TV tuner 4.26 Analog TV tuner Removing the Analog TV tuner The following describes the procedure for removing the analog TV tuner (See Figure 4-40). 1. Remove the following screw securing the analog TV tuner. • M2.0×4B BIND screw ×1 2. Open the left and right latches and remove the analog TV tuner from the connector CN2400 on the system board. M2.
4.27 CPU fan/CPU heat sink/CPU 4 Replacement Procedures 4.27 CPU fan/CPU heat sink/CPU Removing the CPU fan/CPU heat sink/CPU The following describes the procedure for removing the CPU fan/CPU heat sink/CPU (See Figure 4-41 to 4-43). 1. Remove the following screws securing the CPU holder. • M2.0×4B BIND screw ×3 NOTE: When removing the CPU holder, be sure to remove the screws in the reverse order of the number marked on the holder. 2. Remove the CPU holder. 3.
4 Replacement Procedures 4.27 CPU fan/CPU heat sink/CPU 4. Remove the following screw and separate the CPU fan and CPU heat sink. • M2.0×4B BIND screw ×1 CPU fan M2.0x4B BIND CPU heat sink Figure 4-42 Separating the CPU fan and CPU heat sink 5. Unlock the CPU by rotating the cam on the CPU socket 90 degrees counterclockwise with a flat-blade screwdriver. 6. Remove the CPU.
4.27 CPU fan/CPU heat sink/CPU 4 Replacement Procedures Installing the CPU fan/CPU heat sink/CPU The following describes the procedure for installing the CPU fan/CPU heat sink/CPU (See Figure 4-41 to 4-45). 1. Check that the mark of the cam is in the unlocking position. 2. Install the CPU to the correct position in the CPU socket. 3. Fix the CPU by rotating the cam 90 degrees to the clockwise with a flat-blade screwdriver.
4 Replacement Procedures 4.27 CPU fan/CPU heat sink/CPU 4. If there is already silicon grease on the CPU, clean it with a cloth. Using a special applicator, apply silicon grease so that the CPU chip on the CPU is completely covered. NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-45 Applying silicon grease 5. Install the CPU fan to the CPU heat sink and secure them with the following screw. • M2.0×4B BIND screw ×1 6.
4.28 GPU heat sink 4 Replacement Procedures 4.28 GPU heat sink Removing the GPU heat sink The following describes the procedure for removing the GPU heat sink (See Figure 4-46). 1. Remove the following screws securing the GPU holder and GPU heat sink. • M2.0×4B BIND screw ×3 2. Remove the GPU holder and GPU heat sink. NOTE: When removing the GPU holder, be sure to remove the screws in the reverse order of the number marked on the holder. GPU holder M2.
4 Replacement Procedures 4.28 GPU heat sink Installing the GPU heat sink The following describes the procedure for installing the GPU heat sink (See Figure 4-46). 1. Install the GPU heat sink and GPU holder. NOTE: For details on applying the silicon grease, refer to Installing the CPU. 2. Secure the GPU heat sink and GPU holder with the following screws. • M2.0×4B BIND screw ×3 NOTE: When securing the GPU holder, be sure to secure the screws in the order of the number marked on the holder.
4.29 North bridge heat sink 4 Replacement Procedures 4.29 North bridge heat sink Removing the North bridge heat sink The following describes the procedure for removing the north bridge heat sink (See Figure 447). 1. Remove the following screws and north bridge heat sink from the system board. • M2.0×3S S-THIN HEAD screw ×2 M2.
4 Replacement Procedures 4.30 PC card slot 4.30 PC card slot Removing the PC card slot The following describes the procedure for removing the PC card slot (See Figure 4-48). 1. Remove the following screws securing the PC card slot. • M2.0×3S S-THIN HEAD screw ×2 • M2.0×8S BIND screw ×2 2. Pull the PC card slot straight up and remove it from the system board. M2.0x8S BIND M2.
4.30 PC card slot 4 Replacement Procedures Installing the PC card slot The following describes the procedure for installing the PC card slot (See Figure 4-48). 1. Install the PC card slot to the system board and secure it with the following screws. • M2.0×3S S-THIN HEAD screw ×2 • M2.
4 Replacement Procedures 4.31 LCD unit/FL inverter 4 4.31 LCD unit/FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-49 to 4-54). 1. Remove the hinge cap from the slot while releasing latches.
4.31 LCD unit/FL inverter 4 Replacement Procedures 2. Peel off the mask seals and mask pads and remove the following screws securing the LCD mask. • M2.5×6B FLAT BIND screw ×6 3. Insert your finger between the edge of the LCD mask and LCD and remove the LCD mask while releasing the latches. M2.5x6B FLAT BIND (with mask seal) M2.5x6B FLAT BIND (with mask pad) LCD mask M2.
4 Replacement Procedures 4.31 LCD unit/FL inverter 4. Remove the following screw securing the FL inverter. • M2.0×6S ×1 BIND screw 5. Pull off one insulator from the FL inverter and take out the other one under the LCD unit. 6. Disconnect the LCD cables from the connectors on the FL inverter. 7. Disconnect the HV cables from the connectors on the FL inverter. 8. Remove the FL inverter from the display assembly. M2.
4.31 LCD unit/FL inverter 4 Replacement Procedures 9. Remove the following screws securing the LCD unit. • M2.0×6S BIND screw ×4 M2.0x6S BIND M2.
4 Replacement Procedures 4.31 LCD unit/FL inverter 10. With the bottom edge of the LCD unit on the display cover, lift up the top edge of the LCD unit. After peeling off the glass tape, disconnect the LCD cable from the connector on the back of the LCD. 11. Remove the LCD unit.
4.31 LCD unit/FL inverter 4 Replacement Procedures 12. Remove the following screws securing the LCD support and remove the LCD supports from the LCD unit. • M2.0×3S S-THIN HEAD screw ×4 M2.0x3S S-THIN HEAD LCD support M2.
4 Replacement Procedures 4.31 LCD unit/FL inverter Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-49 to 4-54). 1. Install the LCD support to the LCD unit and secure them with the following screws. • M2.0×3S ×4 S-THIN HEAD screw 2. Stand the LCD unit on the display cover and connect the LCD cable to the connector on the back of the LCD and stick the glass tape on it. 3. Secure the LCD unit with the following screws.
4.32 LCD cable 4.32 4 Replacement Procedures LCD cable Removing the LCD cable The following describes the procedure for removing LCD cable (See Figure 4-55 to 4-57). 1. Peel off the insulator and remove the harness hold plate while unlatching.
4 Replacement Procedures 4.32 LCD cable 2. Remove the following screw securing the LCD hold plate and remove the LCD hold plate from the cover assembly. • M2.5×6S ×1 Tapping screw M2.
4.32 LCD cable 4 Replacement Procedures 3. Pass the LCD cable through the hole of the cover assembly to remove it. LCD cable Figure 4-57 Removing the LCD cable Installing the LCD cable The following describes the procedure for installing the LCD cable (See Figure 4-55 to 4-57). 1. Arrange the LCD cable by passing it through the hole of the cover assembly. 2. Install the LCD hold plate and secure it with the following screw. • M2.5×6S Tapping screw ×1 3.
4 Replacement Procedures 4.33 4.33 Wireless LAN antenna/Bluetooth antenna Wireless LAN antenna/Bluetooth antenna Removing the wireless LAN antenna/Bluetooth antenna The following describes the procedure for removing the wireless LAN antennas/Bluetooth antenna (See Figure 4-58 and 4-59). 1. Peel off the acetate tape and draw out the wireless LAN antenna cable and Bluetooth antenna cable.
4.33 Wireless LAN antenna/Bluetooth antenna 4 Replacement Procedures 2. Peel off the acetate tapes fixing the wireless LAN antenna cables and Bluetooth antenna cable and turn up insulator. 3. Peeling off the wireless LAN antennas and Bluetooth antenna from the display rear cover and remove the antennas from the display assembly.
4 Replacement Procedures 4.34 4.34 Latch assembly Latch assembly Removing the Latch assembly The following describes the procedure for removing the latch assembly (See Figure 4-60). 1. Remove the LCD latch knob while releasing latches. 2. Remove the LCD latch hook from the slot. CAUTION: When removing the LCD latch hook, do not lose the spring.
4.35 Display rear cover 4.35 4 Replacement Procedures Display rear cover Removing the display rear cover The following describes the procedure for removing the display rear cover (See Figure 4-61 and 4-62). 1. Remove the following screws securing the display rear cover. • M2.5×6S Tapping screw M2.5x6S Tapping ×4 M2.
4 Replacement Procedures 4.35 Display rear cover 2. Incline the cover assembly a little as shown in the following figure and remove it from the display rear cover. Cover assembly Display rear cover Figure 4-62 Removing the display rear cover (2) Installing the display rear cover The following describes the procedure for installing the display rear cover (See Figure 4-61 and 4-62). 1.
4.36 Hinge 4.36 4 Replacement Procedures Hinge Removing the hinge The following describes the procedure for removing the hinge (See Figure 4-63). 1. Remove the following screw securing the hinge (L). • M2.5×6S ×1 Tapping screw 2. Push down the latch and remove the hinge (L) by sliding it to the right. 3. Remove the following screw securing the hinge (R). • M2.5×6S ×1 Tapping screw 4. Push down the latch and remove the hinge (R) by sliding it to the left. M2.5x6S Tapping Hinge (R) M2.
4 Replacement Procedures 4.36 Hinge Installing the hinge The following describes the procedure for installing the hinge (See Figure 4-63). 1. Install the hinge (R) to the cover assembly and secure it with the following screw. • M2.5×6S Tapping screw ×1 2. Install the hinge (L) to the cover assembly and secure it with the following screw. • M2.
4.37 Fluorescent Lamp 4 Replacement Procedures 4 4.37 Fluorescent lamp This system uses LCD module from the following supplier. Type 15.4 inch Part No. Supplier G33C0002S110 Samsung G33C0002X110 Samsung Section 4.37.1 NOTE: - When working with a LCD module, always use a flat, grounded table. - Handle the backlight unit in the environment without dust, such as on the clean bench. Keep the worktable free from any screws or other material that may scratch the LCD surface.
4 Replacement Procedures 4.37 Fluorescent Lamp 4.37.1 Replacing the 15.4-inch Samsung Fluorescent lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.4-inch Samsung Fluorescent lamp To disassemble the 15.4-inch WXGA Samsung Fluorescent Lamp, follow the steps below and refer to Figure 4-64 to 4-68.
4.37 Fluorescent Lamp 4 Replacement Procedures 2. Remove white tapes stuck on the right and left sides. Figure 4-65 Replacing Samsung fluorescent lamp (WXGA) (2) 3. Remove the lamp wire tape and the aluminum tape stuck on the bottom.
4 Replacement Procedures 4.37 Fluorescent Lamp 4. Unlatch the hooks on the bottom first and then the hooks on the right and left sides to remove the top chassis from the mold frame.
4.37 Fluorescent Lamp 4 Replacement Procedures 5. Remove the panel assembly from the backlight unit. CAUTION: Handle with care not to damage the COF of S/D and G/D ICs. Figure 4-68 Replacing Samsung fluorescent lamp (WXGA) (5) Assembling the 15.4-inch (W-XGA) Samsung fluorescent lamp The assembly procedure is the reverse of the above disassembly procedure.
4 Replacement Procedures 4-92 [CONFIDENTIAL] 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout............................................................................................... B-1 B.1 System board (FUHSY*) Front View........................................................... B-1 B.2 System board (FUHSY*) Back View ........................................................... B-3 B.3 BC board (FUHBC*) ....................
Appendices C.17 CN4400 Bluetooth I/F connector (20-pin)................................................. C-18 C.18 CN4610 USB I/F connector Port5/Port7 (8-pin) ....................................... C-19 C.19 CN4611 USB I/F connector Port0/Port4 (8-pin) ....................................... C-19 C.20 CN5500 LCD I/F connector (40-pin) ........................................................ C-20 C.21 CN5080 RGB I/F connector (15-pin) ........................................................
Appendices SW board (FUHSW*) C.43 CN9660 System board I/F connector (20-pin)........................................... C-30 FS board (FUHFS*) C.44 CN9540 System board I/F connector (6-pin)............................................. C-31 Appendix D Keyboard Scan/Character Codes .............................................................. D-1 D.1 Scan Codes.................................................................................................... D-1 Appendix E Key Layout ................
Appendices Figures Figure B-1 System board layout (front) .......................................................................... B-1 Figure B-2 System board layout (back) .......................................................................... B-3 Figure B-3 BC board layout ............................................................................................ B-5 Figure B-4 JK board layout .............................................................................................
Appendices Tables Table B-1 System board IC and connectors (front) ....................................................... B-2 Table B-2 System board ICs and connectors (back)...................................................... B-4 Table B-3 BC board connectors..................................................................................... B-5 Table B-4 JK board connectors...................................................................................... B-6 Table B-5 LE board connector..
Appendices Table C-23 D-video I/F connector (14-pin)................................................................... C-21 Table C-24 Speaker connector (4-pin)........................................................................... C-22 Table C-25 DC IN connector (4-pin)............................................................................. C-22 Table C-26 Battery connector (10-pin)..........................................................................
Appendices Table D-2 Scan codes with left shift key ....................................................................... D-5 Table D-3 Scan codes with Numlock mode................................................................... D-6 Table D-4 Scan codes with Fn key................................................................................. D-6 Table D-5 Scan codes in overlay mode.......................................................................... D-7 Table D-6 No.
Appendices App-x [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix B Board Layout Appendices Appendix B Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board connectors (front) Number B-2 Name IS2101 Bridge media slot CN6170 Internal speaker connector CN6500 JK board I/F connecter CN9530 FS board I/F connector CN9500 LE board I/F connecter CN9650 SW board I/F connecter CN2600 Wireless LAN card I/F connector CN3490 Debugging port CN3010 MDC I/F connecter CN5500 LCD I/F connecter CN2450 BC board I/F connecter CN4400 Bluetooth FFC connector CN3330 Volume sensor cable connector
Appendix B Board Layout Appendices B.
Appendices Appendix B Board Layout Table B-2 System board ICs and connectors (back) Number B-4 Name CN1400 Memory A I/F connector CN1410 Memory B I/F connector CN1850 HDD-1 I/F connector CN5080 RGB I/F connector CN5502 D-Video connector CN5501 S-Video connector CN1810 ODD connector CN2110 PC card I/F connector CN4200 i.
Appendix B Board Layout Appendices B.
Appendices Appendix B Board Layout B.
Appendix B Board Layout Appendices B.
Appendices Appendix B Board Layout B.
Appendix B Board Layout Appendices B.
Appendices B-10 Appendix B Board Layout [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix C Pin Assignments Appendices Appendix C Appendix C Pin Assignment System board (FUHSY*) C.1 CN1410 Memory B Connector (200-pin) Table C-1 Memory B connector (200-pin) (1/3) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments Table C-1 Memory B connector (200-pin) (2/3) PIN No. 61 63 C-2 Signal name BDQ29-B1P BDQ28-B1P I/O PIN No. I/O I/O 62 64 Signal name BDQ25-B1P BDQ24-B1P I/O I/O I/O 65 GND - 66 GND 67 BDM3-B1P I 68 BDQS3-B1N I/O - 69 N.C. - 70 BDQS3-B1P I/O 71 GND - 72 GND 73 BDQ26-B1P I/O 74 BDQ30-B1P I/O 75 BDQ27-B1P I/O 76 BDQ31-B1P I/O 77 GND - 78 GND - 79 MCKE2-B1P I 80 MCKE3-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.
Appendix C Pin Assignments Appendices Table C-1 Memory B connector (200-pin) (3/3) PIN No. Signal name I/O PIN No.
Appendices C.2 Appendix C Pin Assignments CN1400 Memory A connector (200-pin) Table C-2 Memory A connector (200-pin) (1/3) PIN No. C-4 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices Table C-2 Memory A connector (200-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O I/O - 64 66 ADQ24-B1P GND I/O - 63 65 ADQ28-B1P GND 67 ADM3-B1P I 68 ADQS3-B1N I/O 69 N.C. - 70 ADQS3-B1P I/O 71 GND - 72 GND 73 ADQ30-B1P I/O 74 ADQ27-B1P I/O 75 ADQ26-B1P I/O 76 ADQ31-B1P I/O 77 GND - 78 GND - 79 MCKE0-B1P I 80 MCKE1-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.C - 85 ABS2-B1P I 86 N.
Appendices Appendix C Pin Assignments Table C-2 Memory A connector (200-pin) (3/3) PIN No. C-6 Signal name I/O PIN No.
Appendix C Pin Assignments C.3 Appendices CN1810 ODD I/F connector (50-pin) Table C-3 ODD I/F connector (50-pin) PIN No. Signal name I/O PIN No.
Appendices C.4 Appendix C Pin Assignments CN1850 1st HDD I/F connector (22-pin) Table C-4 1st HDD I/F connector (22-pin) PIN No. C.5 Signal name I/O PIN No.
Appendix C Pin Assignments C.6 Appendices CN2110 PC card I/F connector (150-pin) Table C-6 PC card I/F connector (150-pin) (1/3) PIN No. Signal name I/O PIN No. Signal name I/O 1 3 GND ZUSBEX3-E3N I/O 2 4 GND ZUSBEX-E3P I/O 5 GND - 6 CPUSB-E3N O 7 N.
Appendices Appendix C Pin Assignments Table C-6 PC card I/F connector (150-pin) (2/3) PIN No. C-10 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices Table C-6 PC card I/F connector (150-pin) (3/3) PIN No. Signal name I/O PIN No.
Appendices C.7 Appendix C Pin Assignments IS2101 Bridge media I/F connector (42-pin) Table C-7 Bridge media I/F connector (42-pin) PIN No. C-12 Signal name I/O PIN No.
Appendix C Pin Assignments C.8 Appendices CN2400 WW Tuner I/F connector (124-pin) Table C-8 WW Tuner I/F connector (124-pin) (1/2) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments Table C-8 WW Tuner I/F connector (124-pin) (2/2) PIN No. C-14 Signal name I/O PIN No.
Appendix C Pin Assignments C.9 Appendices CN2450 BC board I/F connector (8-pin) Table C-9 BC board I/F connector (8-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 3 BCAS-P5V BCRST-P3N O 2 4 BCIO-P5P GND 5 XBCCLK-P3P O 6 GND - 7 BCCDET-P3N I 8 GND - GND - 2T GND - 1T I/O - C.10 CN2600 Wireless LAN card I/F connector (52-pin) Table C-10 PIN No. Wireless LAN card I/F connector (52-pin) (1/2) Signal name I/O PIN No.
Appendices Appendix C Pin Assignments Table C-10 Wireless LAN card I/F connector (52-pin) (2/2) PIN No. Signal name I/O PIN No. Signal name I/O 49 51 NC NC - 50 52 GND P3V - 1T GND - 2T GND - C.11 CN3010 MDC I/F connector (12-pin) Table C-11 PIN No. C-16 Signal name MDC I/F connector (12-pin) I/O PIN No.
Appendix C Pin Assignments Appendices C.12 CN3200 Keyboard I/F connector (34-pin) Table C-12 PIN No. Keyboard I/F connector (34-pin) Signal name I/O PIN No.
Appendices Appendix C Pin Assignments C.15 J4100 Network I/F connector (12-pin) Table C-15 PIN No. Signal name Network I/F connector (12-pin) I/O PIN No. Signal name I/O 1 3 ZMDIOP-EYP ZMDI1P-EYP I/O I/O 2 4 ZMDION-EYN ZMDI2P-EYP I/O I/O 5 ZMDI2N-EYP I/O 6 ZMDI1N-EYP I/O 7 ZMDI3P-EYP I/O 8 ZMDI3N-EYP I/O 9 (LAN-E3V) - 10 LLINK-E3N O 11 (LAN-E3V) - 12 LACT-E3N O 1T GND - 2T GND - C.16 CN4200 1394 I/F connector (4-pin) Table C-16 PIN No.
Appendix C Pin Assignments Appendices C.18 CN4610 USB I/F connector Port5/Port7 (8-pin) Table C-18 PIN No. USB I/F connector Port5/Port7 (8-pin) Signal name I/O PIN No. Signal name I/O A1 A3 USB0PS-E5V ZUSBP5-E3P I/O A2 A4 ZUSBP5-E3N GND I/O - B1 USB0PS-E5V - B2 ZUSBP7-E3N I/O B3 ZUSBP7-E3P I/O B4 GND - 1T GND - 2T GND - 3T GND - 4T GND - 5T GND - 6T GND - C.19 CN4611 USB I/F connector Port0/Port4 (8-pin) Table C-19 PIN No.
Appendices Appendix C Pin Assignments C.20 CN5500 LCD I/F connector (40-pin) Table C-20 PIN No. C-20 Signal name LCD I/F connector (40-pin) I/O PIN No.
Appendix C Pin Assignments Appendices C.21 CN5080 RGB I/F connector (15-pin) Table C-21 RGB I/F connector (15-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 SYSRED-PXP O 2 SYSGRN-PXP O 3 SYSBLU-PXP O 4 NC - 5 GND - 6 GND - 7 GND - 8 GND - 9 (P5V) - 10 GND - 11 NC - 12 CRTSDA-P5P O 13 (HSYNC+CRTEN) O 14 (AVSYNC-P3P) O 15 CRTSCL-P5P O 1T GND - 2T GND - C.22 CN5501 S-video OUT connector (4-pin) Table C-22 S-video OUT connector (4-pin) PIN No.
Appendices Appendix C Pin Assignments C.24 CN6170 Speaker connector (4-pin) Table C-24 Speaker connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 SPOTL-PXN O 2 SPOTL-PXP O 3 SPOTR-PXP O 4 SPOTR-PXN O C.25 CN8800 DC IN connector (4-pin) Table C-25 DC IN connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (ADPDC) I 2 (ADPDC) I 3 GND - 4 GND - C.26 CN8810 Battery connector (10-pin) Table C-26 Battery connector (10-pin) PIN No.
Appendix C Pin Assignments Appendices C.28 CN8771 CPU FAN connector (4-pin) Table C-28 CPU FAN connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 P5V - 2 FANGO-P3P O 3 GND - 4 (FPWMO-S3P) O C.29 CN8781 VGA FAN connector (4-pin) Table C-29 VGA FAN connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 P5V - 2 FANG1-P3P O 3 GND - 4 (FPWM1-S3P) O C.30 CN9500 LE board I/F connector (20-pin) Table C-30 LE board I/F connector (20-pin) PIN No.
Appendices Appendix C Pin Assignments C.31 CN9530 FS board I/F connector (6-pin) Table C-31 FS board I/F connector (6-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 Power E3V - 2 FGSPON-P3V O 3 GND - 4 ZUSBFS-E3N I/O 5 ZUSBFS-E3P I/O 6 GND - - 2T GND - 1T GND C.32 CN6500 JK board I/F connector (20-pin) Table C-32 JK board I/F connector (20-pin) PIN No. C-24 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices C.33 CN9650 SW board I/F connector (20-pin) Table C-33 SW board I/F connector (20-pin) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments JK board (FUHJK*) C.34 CN6510 System board I/F connector (20-pin) Table C-34 System board I/F connector (20-pin) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignments Appendices C.37 DS6320 Headphone connector (9-pin) Table C-37 Headphone connector (9-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (SPKEN-P4N) O 2 HEADL2-PXP I 3 HEADR2-PXP I 4 A-GND - 5 SPDJIN-P3N - 6 NC - 7 DOUT-P3P I 8 SPD3V-P3V - 9 GND - C.38 CN9612 TV-in connector (5-pin) Table C-38 TV-in connector (5-pin) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments LE board (FUHLE*) C.40 CN9510 System board I/F connector (20-pin) Table C-40 System board I/F connector (20-pin) PIN No. C-28 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices TP board (FUHTP*) C.41 CN3250 System board I/F connector (4-pin) Table C-41 System board I/F connector (4-pin) PIN No. Signal name 1 GND 3 IPDDAT-P6P 1T I/O PIN No. - 2 IPDCLK-P5P I/O 4 P5V - - 2T GND - GND Signal name I/O I/O C.42 CN3251 Touch pad I/F connector (12-pin) Table C-42 Touch pad I/F connector (12-pin) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments SW board (FUHSW*) C.43 CN9660 System board I/F connector (20-pin) Table C-43 System board I/F connector (20-pin) PIN No. C-30 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices FS board (FUHFS*) C.44 CN9540 System board I/F connector (6-pin) Table C-44 System board I/F connector (6-pin) PIN No. Signal name I/O PIN No.
Appendices C-32 Appendix C Pin Assignments [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix D Keyboard Scan/Character Codes Appendices Appendix. D Appendix D Keyboard Scan/Character Codes D.1 Scan Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendix E Key Layout Appendix E E.1 Appendices Key Layout US Keyboard Figure E-1 US Keyboard layout E.
Appendices E-2 Appendix E Key Layout [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix F Wiring diagrams Appendices Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
Appendices F-2 Appendix F Wiring diagrams [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5.
Appendices G-2 Appendix G BIOS rewrite procedures [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. 1. Replacing of system board 2. Replacing of LCD Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
Appendices H-2 Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix I Reliability Appendix I Appendices Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration.
Appendices I-2 Appendix I Reliability [CONFIDENTIAL] QOSMIO F30 Maintenance Manual (960-555)
Appendix J Maintenance of TOSHIBA RAID Appendices Appendix J Appendix J Maintenance of TOSHIBA RAID J.1 Outline of Maintenance (Repair) of TOSHIBA RAID Follow the below procedures to repair TOSHIBA RAID Reception Is the RAID configured by two HDD?(*1) No Yes Identify the failed HDD (*2) Is it needed to specify the cause? No Yes Perform the HDD Troubleshooting Procedure in Section 2.6.
Appendices Appendix J Maintenance of TOSHIBA RAI J.2 Analysis and handling by Drive Log Follow the below procedures to analyze. Boot the independent utility and check the Physical Drive status. (1) Which port of HDD failed? Port 1 Port 0 (3) Does operation miss cause it? (2) If necessary, analyze the Drive Log and identify the cause of failure. Replace the second HDD with new (good) one. No Yes (4) Change the status of the failed HDD to “OFFLINE”.
Appendix J Maintenance of TOSHIBA RAID Appendices How to identify the cause of failure (1) When “Fail” or “NODRIVE” is displayed. According to “Operation of Independent utility”, boot the independent utility to display the Drive Log. To identify the failure cause of Port 0, analyze the Drive Log of [REDUNDANT] side of Port 1. To identify the failure cause of Port 1, analyze the Drive Log of [REDUNDANT] side of Port 0. Analyze this log. 1.
Appendices Appendix J Maintenance of TOSHIBA RAI 2. Analyze the detailed date of the message of right before of “xxx Error (IN)”, “xxx Error (OUT)” (for example, “DMA Error (IN)”, “DMA Error (OUT)”) right before the log of “Fail this drive” message and identify the cause.
Appendix J Maintenance of TOSHIBA RAID Appendices Command：Indicates Command code caused an error.
Appendices Appendix J Maintenance of TOSHIBA RAI Table J-1 List of Command (2/2) Protocol DM DM DMO PO ND ND ND ND ND ND ND ND PI ND ND ND PO ND PI ND ND PO PO ND PO ND PO ND ND Command READ DMA WRITE DMA WRITE DMA QUEUED CFA WRITE MULTIPLE W/OUT ERASE CHECK MEDIA CARD TYPE GET MEDIA STATUS MEDIA LOCK MEDIA UNLOCK STANDBY IMMEDIATE IDLE IMMEDIATE STANDBY IDLE READ BUFFER CHECK POWER MODE SLEEP FLUSH CACHE WRITE BUFFER FLUSH CACHE EXT IDENTIFY DEVICE MEDIA EJECT SET FEATURES SECURITY SET PASSWORD SECUR
Appendix J Maintenance of TOSHIBA RAID Appendices (2) Check if it is caused by an operation miss or is a failure. To check if the cause of failure of Port1 is an operation miss or not, analyze the Drive Log of Port0. 1. In [REDUNDANT] of Port-0, find a log of “Fail this drive” message by [PgUp] and [PgDn] key. 2. If no message of “Fail this drive” message, it is judged that the second HDD is removed without the operation of removal by TOSHIBA RAID console and installed again.
Appendices Appendix J Maintenance of TOSHIBA RAI J.3 Operation of Independent utility J.3.1 Outline of Independent utility This is a utility to display Drive Log of TOSHIBA RAID. (1) Drive Log TOSHIBA RAID can store about 7,000 logs of Drive Log. TOSHIBA RAID makes Drive Log redundant and stores it. The drive has own log and other drive’s log. In TOSHIBA RAID, the log of own drive is called “Own Log” and the redundant log of other drive’s drive is called “Redundant Log”.
Appendix J Maintenance of TOSHIBA RAID Appendices J.3.2 How to operate the Independent Utility (1) Booting PC Connected the USB FDD to the PC to be repaired. Insert the FD storing the program of the Independent Utility in the FDD and boot the PC from the FD. The following display appears. In the Independent Utility, the cursor is moved by with [↑] key and [↓] key. Press [Enter] key to execute the option selected. Press [Esc] key to return to the previous menu. Pressing [F1] key displays Help.
Appendices Appendix J Maintenance of TOSHIBA RAI (2) Display of Logical/Physical Drive Logical Drive The status of RAID array is displayed in Logical Drive by array. The displayed items are follows. Table J-2 Displayed item in Logical Drive Explanation Status (Status of array) Displays the status of array. The contents are follows. -OPTIMAL：The array works normally. -DEGRADE：The array is degraded. -CRITICAL：The array is failed. It can not be used. RAID Level Displays the RAID level.
Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive In Physical Drive, the condition of RAID array is displayed by array. The following items are displayed. Table J-3 Items displayed in Physical Drive Explanation Port Displays the port number of Serial ATA connected to the drive. Assign Displays the array number and drive number of array that the drive is incorporated. The display format is LD [Array number] [Drive number]. For example, [LD0-1] means the disk drive 1 of Array 0.
Appendices Appendix J Maintenance of TOSHIBA RAI (3) Explanation of Main Menu The Independent Utility has following Main Menu. Table J-4 Item of Main Menu displayed Explanation Create Array Builds RAID array. Start Rebuild Rebuilds RAID-1. While the rebuild is suspended, the message of “Resume Rebuild” is displayed. Check Media Checks if any error in drives configuring array. This is available for the RAID-1 in the “Optimal” condition. Modify Array Changes the setting of array.
Appendix J Maintenance of TOSHIBA RAID Appendices The tree of Independent Menu is as follows.
Appendices Appendix J Maintenance of TOSHIBA RAI Create Array This section explains how to select option and build array. The [Create Array] option can be selected only when there is a drive not assigned. To build array, follow the procedure below. 1. Put the cursor on [Create Array] in [Main Menu] and press [Enter] key. 2. Select RAID level. Put the cursor on [RAID-1] or [RAID-0] and press [Enter] key. 3.
Appendix J Maintenance of TOSHIBA RAID Appendices 6. Put the cursor on the “DONE” and press [Enter] key. Pressing “OK” in [Confirmation] store the change. CAUTION: When the array is initialized, the data of drive is lost. Start Rebuild Selecting of this option starts rebuilding. [Start Rebuild] is displayed only in the RAID1 condition of with “OFFLINE” drive that has same or more size of capacity as the array in the condition of “Optimal” or “Degraded”.
Appendices Appendix J Maintenance of TOSHIBA RAI 3. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated. When [Effective] is selected, rebuild limit becomes valid and it rebuilds up to the rebuild limit. When [Whole] is selected, it rebuilds maximum capacity of array. The [Rebuild Range] menu is not displayed when the rebuild limit is not set or the rebuild limit is the same as the maximum capacity of array. Normally designation of [Effective] is adequate. 4.
Appendix J Maintenance of TOSHIBA RAID Appendices 8. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. Resume Rebuild During being suspended,[Resume Rebuild] is displayed in [Main Menu]. To start rebuilding suspended, follow the procedure below. 1. Put the cursor to the [Resume Rebuild] in the main menu of Indent Utility and press [Enter] key. 2. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated.
Appendices Appendix J Maintenance of TOSHIBA RAI 6. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. 7. When “Rebuild Limit” is set and [Rebuild Range] is set to [Whole], only [Finish] is can be selected after exceeding the Rebuild Limit. When [Finish] is selected and “OK” is selected in [Confirmation], the rebuilding is completed at the time. When OS is booted after exceeding the Rebuild Limit, the rebuild is completed.
Appendix J Maintenance of TOSHIBA RAID Appendices Check Media This option can check if there is an error in the HDD of array. The Check Media can be done only in RAID-1. To execute Check Media, follow the procedure below. 1. Put the cursor to the [Check Media] in [Main Menu] and press [Enter] key. 2. When [Check Range] is displayed, designate the range to be checked. When [Effective] is limited, it makes the rebuild limit effective and execute [Check Media] up to the rebuild limit.
Appendices Appendix J Maintenance of TOSHIBA RAI Modify Array This option changes the setting of array. Change Parameter Select [Change Parameter] in [Modify Array] menu. The following items can be set. Table J-6 Item of array Option J-20 Explanation Write Cache Displays the setting of drive write cache. “Enable (use)” or “Disable (not use)” is displayed. The default is “Enable (use)”. Degrade Bootup Displays if boot OS or not when the array is degraded.
Appendix J Maintenance of TOSHIBA RAID Appendices Change RAID Level To change RAID level, select [Modify Array] menu. When changing RAID-1 (Mirroring) to RAID-0 (Striping), refer “Changing RAID-1 to RAID-0”. When changing RAID-0 to RAID-1, refer “Changing RAID-0 to RAID-1”. Changing RAID-1 to RAID-0 working by one drive When changing RAID-1 array working by two drives to RAID-0 working by one drive, follow the procedure below. 1. Select [Modify Array] in [Main Menu]. 2.
Appendices Appendix J Maintenance of TOSHIBA RAI Delete Array Selects [Delete Array] of Setup Utility and delete array. Put the cursor on the array you want to delete and press [Enter] key. When [Confirmation] is displayed, select “OK” to store the setting.
Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive Select [Physical Drive] in Setup Utility to set physical drive. View Drive Info. Select this option in [Physical Drive] to display information of physical drive. Select the drive that you want to display in [Physical Drive] at the lower of display and press [Enter] key. In the server with fault lamp (lamp displaying disk condition), the fault lamp of corresponded drive blinks while [Drive Information] display appears.
Appendices Appendix J Maintenance of TOSHIBA RAI View Drive Log Select this option in [Physical Drive] menu and select the drive that you want to display the log. At the beginning, the latest log is displayed. The 7,168 logs from the latest are recorded in detail. For the older log, only ID is recorded. The options and functions of key in [View Drive Log] are as follows. Table J-8 Function of option and key Option Explanation Change Port Changes log’s port displayed and port’s own log or redundant log.
Appendix J Maintenance of TOSHIBA RAID Appendices Execute the following procedures to see the drive log in the independent utility. 1. Put on the cursor on [Physical Drive] in [Main Menu] and press [Enter] key. 2. Put on the cursor on [View Drive Log] and press [Enter] key. 3. Select drive that you want to display the log in [Physical Drive] at the lower of display with a cursor key and press [Enter] key. 4. The drive log is displayed.
Appendices Appendix J Maintenance of TOSHIBA RAI The following is displayed. Table J-9 Content of Drive Log display No. J-26 Option Explanation 1 Port Displays the port number of log displayed. 2 Own/Redundant Displays if the displayed log is a log of own port (Own) or a copy of other port log (Redundant). 3 Time Displays the time when the log is recorded in six digits. The format is [Year Month Day Hour Minute Second]. 4 ID Displays identification ID of log.
Appendix J Maintenance of TOSHIBA RAID Appendices [View Drive Log] menu is as follows Table J-10 Content of View Drive Log menu Option Explanation Change Port Changes the display of the own log and redundant log. At the beginning, the Port-0’s own log and the redundant log are displayed. Go to Event When this option selected, it moves to the log with designated number. The key function in [View Drive Log] key is as follows.
Appendices Appendix J Maintenance of TOSHIBA RAI Exit When this option is selected, the utility is finished. When [Confirmation] is displayed, select “OK”.
