Datasheet

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
UCC27323DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27323DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC27324DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27324DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC27325DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27325DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC37323DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC37323DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC37324DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC37324DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC37325DGNR MSOP- DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1