Datasheet

uA78M00 SERIES
www.ti.com SLVS059S –JUNE 1976–REVISED MAY 2013
Absolute Maximum Ratings
(1)
over virtual junction temperature range (unless otherwise noted)
MIN MAX UNIT
V
I
Input voltage 35 V
T
J
Operating virtual junction temperature 150 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Package Thermal Data
(1)
PACKAGE BOARD θ
JP
(2)
θ
JC
θ
JA
PowerFLEX/TO-252 – KTP High K, JESD 51-5 1.4°C/W 19°C/W 28°C/W
SOT-223 – DCY High K, JESD 51-7 30.6°C/W 53°C/W
TO-220 – KC High K, JESD 51-5 3°C/W 17°C/W 19°C/W
TO-220 – KCS High K, JESD 51-5 3°C/W 17°C/W 19°C/W
TO-252 – KVU High K, JESD 51-5 30.3°C/W
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX, θ
JP
is defined as the thermal resistance between
the die junction and the bottom of the exposed pad.
Recommended Operating Conditions
MIN MAX UNIT
uA78M33 5.3 25
uA78M05 7 25
uA78M06 8 25
uA78M08 10.5 25
V
I
Input voltage V
uA78M09 11.5 26
uA78M10 12.5 28
uA78M12 14.5 30
uA78M15 17.5 30
I
O
Output current 500 mA
uA78MxxC 0 125
T
J
Operating virtual junction temperature °C
uA78MxxI –40 125
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