Datasheet

μA78L00
www.ti.com SLVS010U –JANUARY 1976–REVISED MAY 2011
Absolute Maximum Ratings
(1)
over virtual junction temperature range (unless otherwise noted)
MIN MAX UNIT
μA78L02AC, μA78L05C–μA78L09C, μA78L10AC 30
V
I
Input voltage V
μA78L12C, μA78L12AC, μA78L15C, μA78L15AC 35
T
J
Virtual junction temperature 150 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Package Thermal Data
(1)
PACKAGE BOARD θ
JC
θ
JA
SOIC (D) High K, JESD 51-7 39°C/W 97°C/W
TO-92/TO-226AA (LP) High K, JESD 51-7 55°C/W 140°C/W
SOT-89 (PK) High K, JESD 51-7 9°C/W 52°C/W
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability. Due to variations in
individual device electrical characteristics and thermal resistance, the built-in thermal-overload protection may be activated at power
levels slightly above or below the rated dissipation.
Recommended Operating Conditions
MIN MAX UNIT
μA78L02AC 4.75 20
μA78L05C, μA78L05AC 7 20
μA78L06C, μA78L06AC 8.5 20
μA78L08C, μA78L08AC 10.5 23
V
I
Input voltage V
μA78L09C, μA78L09AC 11.5 24
μA78L10AC 12.5 25
μA78L12C, μA78L12AC 14.5 27
μA78L15C, μA78L15AC 17.5 30
I
O
Output current 100 mA
μA78LxxC and μA78LxxAC series 0 125
T
J
Operating virtual junction temperature °C
μA78L05AI –40 125
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