Datasheet

www.ti.com
ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
θJA
SOT223
SOT223
4in
2
Top Side Only
0.5in
2
Top Side Only
53°C/W
110°C/W
1
2
CONDITIONS PACKAGE PCB AREA
Condition 1
Condition 2
3
2
1
0
0 25 50 75
4
5
6
100 125 150
T
A
(°C)
P
D
(W)
TPS794xx
SLVS349E NOVEMBER 2001 REVISED DECEMBER 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
(1)
PRODUCT V
OUT
(2)
TPS794 xxyyyz XX is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Output voltages from 1.3 V to 5.0 V in 100 mV increments are available; minimum order quantities may apply. Contact factory for details
and availability.
over operating temperature range unless otherwise noted
(1)
VALUE
V
IN
range –0.3 V to 6 V
V
EN
range –0.3 V to V
IN
+ 0.3 V
V
OUT
range –0.3 V to 6 V
Peak output current Internally limited
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, T
J
–40 ° C to +150 ° C
Storage temperature range, T
stg
–65 ° C to +150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AIR FLOW R
θ JC
R
θ JA
T
A
25 ° C T
A
= 70 ° C T
A
= 85 ° C
PACKAGE
(CFM) ( ° C/W) ( ° C/W) POWER RATING POWER RATING POWER RATING
0 8.47 55.09 2.27 W 1.45 W 1.18 W
DGN 150 8.21 49.97 2.50 W 1.60 W 1.30 W
250 8.20 48.10 2.60 W 1.66 W 1.35 W
Figure 1. SOT223 Power Dissipation
2
Submit Documentation Feedback