Datasheet

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15
20
25
30
35
40
0 0.01 0.1 1 10 100
THERMAL RESISTANCE
vs
COPPER HEATSINK AREA
Copper Heatsink Area – cm
2
– Thermal Resistance –
θJA
R C/W
°
No Air Flow
150 LFM
250 LFM
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
With 25 Thermal Vias
Thermal Vias, 0.3 mm
Diameter, 1.5 mm Pitch
TPS75601, TPS75615
TPS75618, TPS75625
TPS75633
SLVS329C – JUNE 2001 – REVISED MARCH 2004
THERMAL INFORMATION (continued)
Figure 25.
Figure 26.
From the data in Figure 25 and rearranging Equation 4 , the maximum power dissipation for a different ground
plane area and a specific ambient temperature can be computed (see Figure 27 ).
16