Datasheet

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Mounting Information

Location ofExposed

ThermalPadon

PWPPackage

MinimumRecommended

HeatsinkArea

TPS752xxQ

TPS754xxQ

SLVS242C – MARCH 2000 – REVISED OCTOBER 2007

The primary requirement is to complete the thermal contact between the thermal pad and the PWB metal. The

thermal pad is a solderable surface and is fully intended to be soldered at the time the component is mounted.

Although voiding in the thermal-pad solder-connection is not desirable, up to 50% voiding is acceptable. The data

included in Figure 27 and Figure 28 are for soldered connections with voiding between 20% and 50%. The

thermal analysis shows no significant difference resulting from the variation in voiding percentage.

Figure 30 shows the solder-mask land pattern for the PWP package. The minimum recommended heat-sink area

is also illustrated. This is simply a copper plane under the body extent of the package, including metal routed

under terminals 1, 10, 11, and 20.

Figure 30. PWP Package Land Pattern