Datasheet

P
D
+ (V
IN
* V
OUT
) I
OUT
TPS736xx
www.ti.com SBVS038T –SEPTEMBER 2003–REVISED AUGUST 2010
POWER DISSIPATION space
(6)
The ability to remove heat from the die is different for
each package type, presenting different
Power dissipation can be minimized by using the
considerations in the PCB layout. The PCB area
lowest possible input voltage necessary to assure the
around the device that is free of other components
required output voltage.
moves the heat from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
PACKAGE MOUNTING
are shown in the Thermal Information table. Using
heavier copper will increase the effectiveness in
Solder pad footprint recommendations for the
removing heat from the device. The addition of plated
TPS736xx are presented in Application Bulletin
through-holes to heat-dissipating layers will also
Solder Pad Recommendations for Surface-Mount
improve the heat-sink effectiveness.
Devices (SBFA015), available from the Texas
Instruments web site at www.ti.com.
Power dissipation depends on input voltage and load
conditions. Power dissipation (P
D
) is equal to the
product of the output current times the voltage drop
across the output pass element (V
IN
to V
OUT
):
space
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision S (August, 2009) to Revision T Page
• Replaced Dissipation Ratings Table with Thermal Information Table .................................................................................. 3
Changes from Revision R (May, 2008) to Revision S Page
• Changed Figure 12 ............................................................................................................................................................... 8
• Added paragraph about recommended start-up sequence to Internal Current Limit section ............................................. 13
• Added paragraph about current foldback and device start-up to Enable Pin and Shutdown section ................................ 13
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