Datasheet

6.2 Bill of Materials
www.ti.com Schematic and Bill of Materials
Table 1. TPS727xxDSEEVM-406 BOM
-001 -002 -003 RefDes Value Description Size Part Number MFR
2 2 2 C1, C2 1.0 µ F Capacitor, Ceramic, 6.3V, X5R, 20%. 0603 STD Any
4 4 4 J1, J2, J3, J4 PEC02SAAN Header, 2-pin, 100mil spacing TH PEC02SAAN Sullins
1 1 1 JP1 PEC03SAAN Header, 3-pin, 100mil spacing TH PEC03SAAN Sullins
1 0 0 U1 TPS72715DSE IC, 200mA Ultra-low IQ LDO with Auto-Low Power Mode SON-6 TPS72715DSE TI
0 1 0 U1 TPS72718DSE IC, 200mA Ultra-low IQ LDO with Auto-Low Power Mode SON-6 TPS72718DSE TI
0 0 1 U1 TPS72728DSE IC, 200mA Ultra-low IQ LDO with Auto-Low Power Mode SON-6 TPS72728DSE TI
1 1 1 N/A PCB, FR-4, 4-Layer, SMOBC, 0.695" x 0.840" × 0.062" HPA406** Any
1 1 1 N/A Shunt, Open-top 151-8000-E Kobiconn
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants.
Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted.
All other components can be substituted with equivalent MFG's components.
SLVU325 – August 2009 TPS727xxDSEEVM-406 7
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