Datasheet

15
20
25
30
35
40
0.1 1 10 100
Copper Heatsink Area − cm
2
− Thermal Resistance −
θJA
R C/W
°
No Air Flow
150 LFM
250 LFM
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
with 25 Thermal Vias
Thermal Vias, 0.3 mm
Diameter, 1,5 mm Pitch
TPS72501
TPS72515, TPS72516
TPS72518, TPS72525
www.ti.com SLVS341E –MAY 2002–REVISED JUNE 2010
Figure 21. DDPAK Thermal Resistance vs Copper Heatsink Area
Figure 22. DDPAK Thermal Resistance
From the data in Figure 23 and rearranging Equation 6, the maximum power dissipation for a different ground
plane area and a specific ambient temperature can be computed.
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