Datasheet

100
75
50
25
0 2 3 5
125
150
7 8
1 4 60.3
Natural Convection
50ft/min
250ft/min
300ft/min
100ft/min
150ft/min
200ft/min
CopperHeatsinkArea - cm
2
R ThermalResistance- C/W
qJA
-
°
TPS70345, TPS70348
TPS70351, TPS70358
TPS70302
www.ti.com SLVS285H –AUGUST 2000–REVISED APRIL 2010
The thermal pad is directly connected to the substrate of the IC, which for the TPS703xx series is a secondary
electrical connection to device ground. The heat-sink surface that is added to the PWP can be a ground plane or
left electrically isolated. In TO220-type surface-mount packages, the thermal connection is also the primary
electrical connection for a given terminal which is not always ground. The PWP package provides up to 24
independent leads that can be used as inputs and outputs (Note: leads 1, 12, 13, and 24 are internally
connected to the thermal pad and the IC substrate).
THERMAL RESISTANCE
vs COPPER HEATSINK AREA
Figure 34.
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