Datasheet

TPS63060

TPS63061

SLVSA92A –DECEMBER 2011– REVISED FEBRUARY 2012

www.ti.com

LAYOUT CONSIDERATIONS

For all switching power supplies, the layout is an important step in the design, especially at high peak currents

and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as

well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground

tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.

Use a common ground node for power ground and a different one for control ground to minimize the effects of

ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.

The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the

control ground, short traces are recommended as well, separation from the power ground traces. This avoids

ground shift problems, which can occur due to superimposition of power ground current and control ground

current.

THERMAL INFORMATION

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added

heat sinks and convection surfaces, and the presence of other heat-generating components affect the

power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

• Improving the power dissipation capability of the PCB design

• Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™

• Introducing airflow in the system

For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal

Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).

Product Folder Link(s): TPS63060 TPS63061