Datasheet

TPS62090 , TPS62091 , TPS62092 , TPS62093
SLVSAW2B –MARCH 2012–REVISED APRIL 2014 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN MAX
PVIN, AVIN, FB, SS, EN, FREQ, VOS
(2)
–0.3 7 V
Voltage range
SW, PG –0.3 V
IN
+0.3 V
Power Good sink current PG 1 mA
Continuous total power dissipation See the Thermal Table
Operating junction temperature range, T
J
–40 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM) per ANSI/ESDA/JEDEC
–2 2 kV
JS-001, all pins
(1)
V
(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC
–500 500 V
specification JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1)
MIN TYP MAX UNIT
V
IN
Input voltage range V
IN
2.5 6 V
T
A
Operating ambient temperature –40 85 °C
T
J
Operating junction temperature –40 125 °C
(1) See the application section for further information
7.4 Thermal Information
TPS6209x
THERMAL METRIC
(1)
UNIT
QFN (16 PINS)
R
θJA
Junction-to-ambient thermal resistance 47
R
θJCtop
Junction-to-case (top) thermal resistance 60
R
θJB
Junction-to-board thermal resistance 20
°C/W
ψ
JT
Junction-to-top characterization parameter 1.5
ψ
JB
Junction-to-board characterization parameter 20
R
θJCbot
Junction-to-case (bottom) thermal resistance 5.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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