Datasheet

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THERMAL INFORMATION
TYPICAL APPLICATIONS
Vout
3.3V/0.6A
Vin
3.6V to 6.0V
VIN
VIN
EN
MODE
SW
FB
PGND
PGND
SW
GND
2
3
1
4 9
10
5
7
8
6
TPS62020
C3
10uF
C1
22pF
L1
3.3uH
C4
22uF
R2
110k
R1
620k
C2
150pF
C5
22uF
Vout
1.8V/0.6A
Vin
2.5V to 6.0V
VIN
EN
MODE
SW
FB
PGND
PGND
SW
GND
2
3
1
4 9
10
5
7
8
6
TPS62020
C3
10uF
C1
22pF
L1
6.8uH
C4
22uF
R2
240k
R1
620k
C2
68pF
VIN
Vout
1.2V/0.6A
Vin
2.5V to 6.0V
VIN
EN
MODE
SW
FB
PGND
PGND
SW
GND
2
3
1
4 9
10
5
7
8
6
TPS62020
C3
10uF
C1
33pF
L1
10uH
C4
10uF
R2
330k
R1
470k
C2
68pF
VIN
TPS62020
TPS62021
TPS62026
SLVS076C – JUNE 2003 – REVISED DECEMBER 2004
One of the most influential components on the thermal performance of a package is board design. In order to
take full advantage of the heat dissipating abilities of the PowerPAD™ packages, a board should be used that
acts similar to a heat sink and allows for the use of the exposed (and solderable), deep downset pad. For further
information please refer to Texas Instruments application note (SLMA002 ) PowerPAD Thermally Enhanced
Package.
The PowerPAD™ of the 10-pin MSOP package has an area of 1,52 mm × 1,79 mm ( ± 0,05 mm) and must be
soldered to the PCB to lower the thermal resistance. Thermal vias to the next layer further reduce the thermal
resistance.
Figure 17. Li-Ion to 3.3 V With Improved Load Transient Response
Figure 18. 1.8 V Output Using 6.8 µH Inductor
Figure 19. 1.2 V Output Using 10 µH Inductor
16