Datasheet

    
   
SLVS132F − NOVEMBER 1995 − REVISED OCTOBER 2004
3
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TPS28xxY chip information
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive
epoxy or a gold-silicon preform.
57
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
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max OPERATING TEMPERATURE = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(7)
(6)
(1)
(5)
(2)
(3)
GND
1OUT
V
CC
REG_IN
1IN
TPS2811Y
TPS2812Y
TPS2813Y
REG_OUT
(8)
(4)
2IN
47
(1) (8)
(7)
(2)
(3)
(4)
(5)
(6)
2OUT
(6)
(5)
(1)
(4)
(2)
(8)
GND
1OUT
V
CC
1IN1
1IN2
TPS2814Y
(7)
(3)
2IN1
2OUT
2IN2
(6)
(5)
(1)
(4)
(2)
(8)
GND
1OUT
V
CC
1IN1
1IN2
TPS2815Y
(7)
(3)
2IN1
2OUT
2IN2