Datasheet

TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
SLVS490I –DECEMBER 2003–REVISED OCTOBER 2009 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION (CONTINUED)
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1.5 A
typically.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMEND TYPICAL PACKAGED
ED SHORT- DEVICES
(1)
MAXIMUM CIRCUIT NUMBER OF
T
A
ENABLE
CONTINUOUS CURRENT SWITCHES
MSOP (DGN) SOIC (D) SOT23 (DBV)
(2)
LOAD LIMIT
CURRENT AT 25°C
Active low TPS2061DGN TPS2061D -
Single
Active high TPS2065DGN TPS2065D -
Active low TPS2062DGN TPS2062D -
Dual
Active high TPS2066DGN TPS2066D -
-40°C to 85°C 1 A 1.5 A
Active low - TPS2063D -
Triple
Active high - TPS2067D -
Active low - - TPS2061DBV
Single
Active high - - TPS2065DBV
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2062DR).
(2) The printed circuit board layout is important for control of temperature rise when operated at high ambient temperatures.
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ORDERING INFORMATION
T
A
SOIC(D)
(1)
STATUS MSOP (DGN)
(1)
STATUS SOT23 (DBV)
(2)
STATUS
TPS2061DG4 Active TPS2061DGNG4 Active - -
TPS2062DG4 Active TPS2062DGNG4 Active - -
TPS2065DG4 Active TPS2065DGNG4 Active - -
-40°C to 85°C
TPS2066DG4 Active TPS2066DGNG4 Active - -
- - - - TPS2061DBV Active
- - - - TPS2065DBV Active
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) The printed circuit board layout is important for control of temperature rise when operated at high ambient temperatures.
2 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS2061 TPS2062 TPS2063 TPS2065 TPS2066 TPS2067