Datasheet

TPD2E001
SLLS684H –JULY 2006–REVISED AUGUST 2014 www.ti.com
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
T
A
Operating free-air Temperature Range –40 85 °C
Operating Voltage V
CC
Pin 0.9 5.5 V
IO1, IO2 Pins 0 V
CC
6.4 Thermal Information
TPD2E001
THERMAL METRIC
(1)
DRY DRL DRS DZD UNIT
5 PINS 5 PINS 6 PINS 4 PINS
R
θJA
Junction-to-ambient thermal resistance 374.2 257.6 91.9 213.7
R
θJC(top)
Junction-to-case (top) thermal resistance 223.4 97.6 106.9 93.5
R
θJB
Junction-to-board thermal resistance 227.8 74.2 64.8 56.8
°C/W
ψ
JT
Junction-to-top characterization parameter 52.9 7.5 10.2 4.2
ψ
JB
Junction-to-board characterization parameter 224.8 73.7 64.9 56.4
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 87.5 N/A 29.9 N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
V
CC
= 5 V ± 10%, T
A
= –40°C to 85° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
CC
Supply voltage 0.9 5.5 V
I
CC
Supply current 1 100 nA
V
F
Diode forward voltage I
F
= 10 mA 0.65 0.95 V
V
BR
Breakdown Voltage I
BR
= 10 mA 11 V
Positive transients V
CC
+ 25
T
A
= 25°C, ±15-kV HBM,
I
F
= 10 A
Negative transients –25
T
A
= 25°C, Positive transients V
CC
+ 60
±8-kV Contact Discharge
V
C
Channel clamp voltage
(2)
V
Negative transients –60
(IEC 61000-4-2), I
F
= 24 A
T
A
= 25°C, Positive transients V
CC
+ 100
±15-kV Air-Gap Discharge
Negative transients –100
(IEC 61000-4-2), I
F
= 45 A
I
i/o
Channel leakage current V
I/O
= GND to V
CC
–1 1 nA
C
i/o
Channel input capacitance V
CC
= 5 V, Bias of V
CC
/2 1.5 pF
(1) Typical values are at V
CC
= 5 V and T
A
= 25 °C
(2) Channel clamp voltage is not production tested.
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