Datasheet
www.ti.com
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATING TABLE
TPA6111A2
SLOS313B – DECEMBER 2000 – REVISED JUNE 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
T
A
SMALL OUTLINE
(1)
MSOP
(1)
SYMBOLIZATION
(D) (DGN)
–40°C to 85°C TPA6111A2D TPA6111A2DGN TI AJA
(1) The D and DGN package is available in left-ended tape and reel only (e.g., TPA6111A2DR,
TPA6111A2DGNR).
Terminal Functions
TERMINAL
I/O DESCRIPTION
NAME NO.
BYPASS 3 I Tap to voltage divider for internal mid-supply bias supply. Connect to a 0.1-µF to 1-µF low ESR capacitor
for best performance.
GND 4 I GND is the ground connection.
IN1– 2 I IN1– is the inverting input for channel 1.
IN2– 6 I IN2– is the inverting input for channel 2.
SHUTDOWN 5 I Puts the device in a low quiescent current mode when held high
V
DD
8 I V
DD
is the supply voltage terminal.
V
O1
1 O V
O1
is the audio output for channel 1.
V
O2
7 O V
O2
is the audio output for channel 2.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
V
DD
Supply voltage 6 V
V
I
Input voltage –0.3 V to V
DD
+ 0.3 V
Continuous total power dissipation internally limited
T
J
Operating junction temperature range –40°C to 150°C
T
stg
Storage temperature range –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1) Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
T
A
≤ 25°C DERATING FACTOR T
A
= 70°C T
A
= 85°C
PACKAGE
POWER RATING ABOVE T
A
= 25°C POWER RATING POWER RATING
D 725 mW 5.8 mW/°C 464 mW 377 mW
DGN 2.14 W
(1)
17.1 mW/°C 1.37 W 1.11 W
(1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD package. The thermal data was
measured on a PCB layout based on the information in the section entitled Texas Instruments
Recommended Board for PowerPAD on page 33 of the before-mentioned document.
2