Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2771CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2771CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV2771CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2771IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2771IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV2771IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2772AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2772AMDRG4 SOIC D 8 2500 367.0 367.0 35.0
TLV2772CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2772CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2772CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2772IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2772IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2772IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2772MDR SOIC D 8 2500 367.0 367.0 35.0
TLV2772MDRG4 SOIC D 8 2500 367.0 367.0 35.0
TLV2773IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2773IDR SOIC D 14 2500 367.0 367.0 38.0
TLV2774AIDR SOIC D 14 2500 367.0 367.0 38.0
TLV2774CDR SOIC D 14 2500 367.0 367.0 38.0
TLV2774CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2774IDR SOIC D 14 2500 367.0 367.0 38.0
TLV2774IPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2775IDR SOIC D 16 2500 367.0 367.0 38.0
TLV2775IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 3