Datasheet

TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765
FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS326F − JUNE 2000 − REVISED AUGUST 2013
17
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
general power dissipation considerations (continued)
1
0.75
0.5
0
−55 −40 −25 −10 5
Maximum Power Dissipation − W
1.25
1.5
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.75
20 35 50
0.25
T
A
− Free-Air Temperature − °C
2
65 80 95 110 125
MSOP Package
Low-K Test PCB
θ
JA
= 260°C/W
T
J
= 150°C
PDIP Package
Low-K Test PCB
θ
JA
= 104°C/W
SOIC Package
Low-K Test PCB
θ
JA
= 176°C/W
SOT-23 Package
Low-K Test PCB
θ
JA
= 324°C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 35. Maximum Power Dissipation vs Free-Air Temperature