Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV271CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV271CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV271CDR SOIC D 8 2500 340.5 338.1 20.6
TLV271IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV271IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV272CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV272CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV272CDR SOIC D 8 2500 340.5 338.1 20.6
TLV272IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV272IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV272IDR SOIC D 8 2500 340.5 338.1 20.6
TLV274CDR SOIC D 14 2500 333.2 345.9 28.6
TLV274CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV274IDR SOIC D 14 2500 333.2 345.9 28.6
TLV274IPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2