Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2620IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TLV2620IDBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TLV2620IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2621IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2621IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2621IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2622IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2622IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2623IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2623IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2624IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2624IPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2625IDR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 2