Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2473AIDR SOIC D 14 2500 367.0 367.0 38.0
TLV2473CDGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0
TLV2473CDGQR MSOP-PowerPAD DGQ 10 2500 364.0 364.0 27.0
TLV2473CDR SOIC D 14 2500 367.0 367.0 38.0
TLV2473IDGQR MSOP-PowerPAD DGQ 10 2500 358.0 335.0 35.0
TLV2474AIDR SOIC D 14 2500 367.0 367.0 38.0
TLV2474AIPWPR HTSSOP PWP 14 2000 367.0 367.0 35.0
TLV2474AIPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2474CDR SOIC D 14 2500 367.0 367.0 38.0
TLV2474CPWPR HTSSOP PWP 14 2000 367.0 367.0 35.0
TLV2474IDR SOIC D 14 2500 367.0 367.0 38.0
TLV2474IPWPR HTSSOP PWP 14 2000 367.0 367.0 35.0
TLV2475AIDR SOIC D 16 2500 367.0 367.0 38.0
TLV2475AIPWPR HTSSOP PWP 16 2000 367.0 367.0 35.0
TLV2475CDR SOIC D 16 2500 367.0 367.0 38.0
TLV2475CPWPR HTSSOP PWP 16 2000 367.0 367.0 35.0
TLV2475IPWPR HTSSOP PWP 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Sep-2012
Pack Materials-Page 4