Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2461IDR SOIC D 8 2500 367.0 367.0 35.0
TLV2461IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2462AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2462CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2462CDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2462CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2462IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2462IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2462IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2463AIDR SOIC D 14 2500 367.0 367.0 38.0
TLV2463AQPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
TLV2463CDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2463CDR SOIC D 14 2500 367.0 367.0 38.0
TLV2463IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2463QPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
TLV2464AIDR SOIC D 14 2500 333.2 345.9 28.6
TLV2464AIPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2464CDR SOIC D 14 2500 333.2 345.9 28.6
TLV2464CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2464IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2464IPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2465CDR SOIC D 16 2500 367.0 367.0 38.0
TLV2465CPWR TSSOP PW 16 2000 367.0 367.0 35.0
TLV2465IDR SOIC D 16 2500 367.0 367.0 38.0
TLV2465IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 4