Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
31-Oct-2013
Addendum-Page 7
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV24
61MFKB
TLV2461MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0051203QPA
TLV2461M
TLV2461MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051203QHA
TLV2461M
TLV2461QD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 V2461Q
TLV2461QDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2461Q
TLV2461QDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 V2461Q
TLV2461QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2461Q
TLV2461QPWR OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 V2461Q
TLV2461QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2461Q
TLV2462AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI
TLV2462AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI
TLV2462AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI
TLV2462AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 2462AI
TLV2462AIP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 TLV2462AI
TLV2462AIPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 TLV2462AI
TLV2462AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
0051206Q2A
TLV2462A
MFKB
TLV2462AMJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 TLV2462AMJG
TLV2462AMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 0051206QPA
TLV2462AM
TLV2462AMUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 0051206QHA
TLV2462AM