Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2401CDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2401CDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2401CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2401IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TLV2401IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TLV2401IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2401IDR SOIC D 8 2500 367.0 367.0 35.0
TLV2402CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2402CDR SOIC D 8 2500 340.5 338.1 20.6
TLV2402IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2402IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2404CPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2404IDR SOIC D 14 2500 367.0 367.0 38.0
TLV2404IPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Sep-2012
Pack Materials-Page 2