Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2370IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0
TLV2370IDBVT SOT-23 DBV 6 250 182.0 182.0 20.0
TLV2370IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2371IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV2371IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV2371IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2372IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
TLV2372IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TLV2372IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2373IDGSR VSSOP DGS 10 2500 358.0 335.0 35.0
TLV2373IDGSR VSSOP DGS 10 2500 364.0 364.0 27.0
TLV2373IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2374IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2374IPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2375IDR SOIC D 16 2500 333.2 345.9 28.6
TLV2375IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Nov-2012
Pack Materials-Page 2