Datasheet
µ
SLOS270D − MARCH 2001 − REVISED JANUARY 2005
2
WWW.TI.COM
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
FAMILY PACKAGE TABLE
(1)
DEVICE
NUMBER OF
PACKAGE TYPES
SHUTDOWN
UNIVERSAL
DEVICE
NUMBER OF
CHANNELS
PDIP SOIC SOT-23 TSSOP MSOP
SHUTDOWN
UNIVERSAL
EVM BOARD
TLV2370 1 8 8 6 — — Yes
TLV2371 1 8 8 5 — — —
Refer to the EVM
TLV2372 2 8 8 — — 8 —
Refer to the EVM
Selection Guide
TLV2373 2 14 14 — — 10 Yes
Selection Guide
(Lit# SLOU060)
TLV2374 4 14 14 — 14 — —
(Lit# SLOU060)
TLV2375 4 16 16 — 16 — Yes
TLV2370 and TLV2371 AVAILABLE OPTIONS
(1)
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
†
SOT-23
PLASTIC DIP
T
A
25°C
SMALL OUTLINE
(D)
†
(DBV)
‡
SYMBOL
PLASTIC DIP
(P)
−40°C to 125°C 4.5 mV
TLV2370ID
TLV2371ID
TLV2370IDBV
TLV2371IDBV
VBFI
VBGI
TLV2370IP
TLV2371IP
†
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2370IDR).
‡
This package is only available taped and reeled. For standard quantities (3,000 pieces per reel), add an R suffix (e.g., TLV2370IDBVR). For
smaller quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g., TLV2370IDBVT).
TLV2372 AND TLV2373 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL
OUTLINE
MSOP
PLASTIC
DIP
PLASTIC
DIP
T
A
25°C
OUTLINE
(D)
§
(DGK)
§
SYMBOL (DGS)
§
SYMBOL
DIP
(N)
DIP
(P)
−40°C
to
125°C
4.5 mV
TLV2372ID
TLV2373ID
TLV2372IDGK
—
APG
—
—
TLV2373IDGS
—
API
—
TLV2373IN
TLV2372IP
—
§
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2372IDR).
TLV2374 and TLV2375 AVAILABLE OPTIONS
(1)
V
IO
MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25°C
SMALL OUTLINE
(D)
¶
PLASTIC DIP
(N)
TSSOP
(PW)
¶
−40°C to 125°C 4.5 mV
TLV2374ID
TLV2375ID
TLV2374IN
TLV2375IN
TLV2374IPW
TLV2375IPW
¶
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number
(e.g., TLV2374IDR).
1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.