Datasheet

TLV2371-Q1, TLV2372-Q1, TLV2374-Q1
FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS
SGLS244A − MAY 2004 − REVISED JUNE 2008
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FAMILY PACKAGE TABLE
{
DEVICE
NUMBER OF
PACKAGE TYPES
}
UNIVERSAL
DEVICE
NUMBER
OF
CHANNELS
SOIC SOT-23 TSSOP MSOP
UNIVERSAL
EVM BOARD
TLV2371 1 8 5 — —
See the EVM
TLV2372 2 8 — — 8
See
the
EVM
Selection Guide
TLV2374 4 14 — 14 —
Selection
Guide
(SLOU060)
†
For the most current package and ordering information, see the Package Option Addendum at
the end of this document, or see the TI web site at http://www.ti.com.
‡
Package drawings, thermal data, and symbolization are available at
http://www.ti.com/packaging.
TLV2371 AVAILABLE OPTIONS
V MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
SOT-23
T
A
25°C
SMALL
OUTLINE
(D)
(DBV) SYMBOL
−40°C to 125°C 4.5 mV TLV2371QDRQ1 TLV2371QDBVRQ1
†
†
Product Preview
TLV2372 AVAILABLE OPTIONS
V MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25
°
C
SMALL OUTLINE
MSOP
T
A
25°C
SMALL
OUTLINE
(D)
(DGK) SYMBOL
−40°C to 125°C 4.5 mV TLV2372QDRQ1 TLV2372QDGKRQ1
†
†
Product Preview
TLV2374 AVAILABLE OPTIONS
V MAX AT
PACKAGED DEVICES
T
A
V
IO
MAX AT
25°C
SMALL OUTLINE
(D)
TSSOP
(PW)
−40°C to 125°C 4.5 mV TLV2374QDRQ1 TLV2374QPWRQ1