Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV2262AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262A
TLV2262AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262A
TLV2262AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262A
TLV2262AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 V2262A
TLV2262AIP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 TLV2262AI
TLV2262AIPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type -40 to 125 TLV2262AI
TLV2262AIPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY262A
TLV2262AIPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY262A
TLV2262AIPWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125
TLV2262AIPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY262A
TLV2262AIPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 TY262A
TLV2262AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9550403Q2A
TLV2262
AMFKB
TLV2262AMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 9550403QPA
TLV2262AM
TLV2262AMUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 9550403QHA
TLV2262AM
TLV2262AQD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 V2262A
TLV2262AQDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2262A
TLV2262AQDR OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 V2262A
TLV2262AQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM V2262A