Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV2262AIDR SOIC D 8 2500 340.5 338.1 20.6
TLV2262AIPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLV2262IDR SOIC D 8 2500 340.5 338.1 20.6
TLV2264AIDR SOIC D 14 2500 333.2 345.9 28.6
TLV2264AIPWR TSSOP PW 14 2000 367.0 367.0 35.0
TLV2264IDR SOIC D 14 2500 333.2 345.9 28.6
TLV2264IPWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2013
Pack Materials-Page 2