Datasheet

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS

SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2021Y chip information
This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
Jmax
= 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
−
OUT
IN +
IN−
V
CC+
(7)
(3)
(2)
(6)
(4)
V
CC −
/GND
(1)
(5)
OFFSET N1
OFFSET N2
78
54
(1)
(2) (3)
(4)
(5)(6)(7)