Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLE2021ACDR SOIC D 8 2500 340.5 338.1 20.6
TLE2021ACDR SOIC D 8 2500 367.0 367.0 35.0
TLE2021AIDR SOIC D 8 2500 340.5 338.1 20.6
TLE2021CDR SOIC D 8 2500 340.5 338.1 20.6
TLE2021CPWR TSSOP PW 8 2000 367.0 367.0 35.0
TLE2021IDR SOIC D 8 2500 340.5 338.1 20.6
TLE2022ACDR SOIC D 8 2500 340.5 338.1 20.6
TLE2022AIDR SOIC D 8 2500 340.5 338.1 20.6
TLE2022AMDR SOIC D 8 2500 367.0 367.0 35.0
TLE2022CDR SOIC D 8 2500 340.5 338.1 20.6
TLE2022IDR SOIC D 8 2500 340.5 338.1 20.6
TLE2022MDR SOIC D 8 2500 367.0 367.0 35.0
TLE2024ACDWR SOIC DW 16 2000 367.0 367.0 38.0
TLE2024CDWR SOIC DW 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2012
Pack Materials-Page 2