Datasheet
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2022Y chip information
This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
−
OUT
IN +
IN−
V
CC+
(8)
(6)
(3)
(2)
(5)
(1)
−
+
(7)
IN +
IN−
OUT
(4)
V
CC −
80
86
(1)
(2)
(3)
(4)
(5)
(6)(7)
(8)