Datasheet

TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC374Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC374C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
JMAX
= 150°C
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS.
PIN (12) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
3OUT
3IN+
3IN–
GND
(10)
(9)
(8)
(11)
(14)
–
+
(13)
4IN+
4IN–
4OUT
(12)
+
–
V
DD
(3)
(4)
(7)
(6)
(5)
(1)
–
+
(2)
65
90
1IN+
1IN–
2OUT
1OUT
2IN+
2IN–
(13)
(14)
(1)
(2) (3)
(4) (5)
(6)
(7)
(8)
(9)(10)(11)
(12)